Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Erik Kalland"'
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
The shear strength of epoxy and acrylic adhesives mixed with different type of conductive adhesives have been tested. The epoxy-based adhesives provide the highest shear strength. Replacing silver flakes with silver coated polymer spheres also provid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14105c030f6ef7e3b4335f1f4af5981e
https://doi.org/10.1109/estc48849.2020.9229831
https://doi.org/10.1109/estc48849.2020.9229831
Autor:
Dan V. Goia, Helge Kristiansen, Jianying He, Sigurd Rolland Pettersen, Keith Redford, John Njagi, Zhiliang Zhang, Erik Kalland, Susanne Helland
Publikováno v:
Journal of Electronic Materials. 46:4256-4266
Isotropic conductive adhesives (ICAs) are alternatives to metallic solders as interconnects in solar modules and electronic devices, but normally require silver contents >25 vol.% and elevated curing temperatures to achieve reasonable conductivity. I
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::723f4caea9daf65bb417916c360dca2f
https://doi.org/10.1007/s11664-017-5376-1
https://doi.org/10.1007/s11664-017-5376-1
Autor:
Andreas Vogl, Faycal Hamou, Helge Kristiansen, Daniel Nilsen Wright, Sigbjørn Kolberg, Erik Kalland, Thor Bakke, Maaike M. Visser Taklo, Astrid-Sofie B. Vardoy
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-25
Low cost and miniaturized solutions for assembly of optical microelectromechanical systems (MOEMS) are critical for increased exploitation of optical sensors and devices in consumer applications. Examples of applications based on optical sensors and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a2e6a42b7223979dc870cafb8254951
https://doi.org/10.4071/2017dpc-tha3_presentation3
https://doi.org/10.4071/2017dpc-tha3_presentation3
Publikováno v:
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
The electrical and thermal properties of a novel conductive adhesive based on silver coated polymer spheres have been measured. The results show that high electrical and thermal conductivity can be obtained with very small volume fractions of silver.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4482e5cc5c009871cccd16f6b18d2f4a
https://doi.org/10.23919/nordpac.2018.8423853
https://doi.org/10.23919/nordpac.2018.8423853
Autor:
Helge Kristiansen, Corinna Grosse, Sigurd Rolland Pettersen, Guillaume Davee, Erik Kalland, Keith Redford, Nina H. Hoglund, Séverine Gomès, Liana Ramiandrisoa, Mohammad Abo Ras, Bruno Hay, Susanne Helland
Publikováno v:
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Sep 2017, Amsterdam, Netherlands. pp.1-5
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Sep 2017, Amsterdam, Netherlands. pp.1-5
A novel and low silver content isotropic conductive adhesive (ICA) has been developed and characterised. The conductive particles are based on a silver coated polymer sphere. The thermal properties of the ICAs have been investigated by two different
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d767a69ef89831471776f6c5b3eec41f
https://doi.org/10.1109/therminic.2017.8233820
https://doi.org/10.1109/therminic.2017.8233820
Autor:
Erik Kalland, Keith Redford, Zhiliang Zhang, Jianying He, Susanne Helland, Sigurd Rolland Pettersen, Helge Kristiansen
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Replacing the silver flakes in conventional isotropic conductive adhesives (ICAs) with micron sized polymer spheres coated with tens to hundreds nanometer of silver (AgPS) drastically reduces the silver content required to obtain good electrical and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e14309a87a6d300e68ab87f38cbd3f8
https://doi.org/10.1109/ectc.2016.53
https://doi.org/10.1109/ectc.2016.53