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Autor:
Nagendra Sekhar Vasarla, Srinivasa Rao Vempati, Eric Woon Yik Yong, Chee Houe Khong, Guan Kian Lau, C. Teo, Khan O K Navas, Hyoung Joon Kim, Vincent Lee, D.M. Fernandez, David Ho, Ser Choong Chong
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
In this paper, we focus how to overcome process challenges, such as die shift and warpage, and to fabricate thin embedded wafer level packages (EMWLPs) with 200μm-thick eventually. The initial warpage of reconfigured wafer after post mold curing (PM
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f830fbb2c44bb5b18e9a2ff10af81bc
https://doi.org/10.1109/ectc.2011.5898495
https://doi.org/10.1109/ectc.2011.5898495
