Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Eric Wong Soon Kiong"'
Publikováno v:
International Symposium for Testing and Failure Analysis.
Viewing the cross section of wafers with glass carriers has always been a challenging task. Add on to observing and determining the glue coverage is an uphill struggle due to the fragile nature of the glue. The traditional technique of cleaving wafer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::404a8e00860eb6906a6a7978cc181a45
https://doi.org/10.31399/asm.cp.istfa2022p0382
https://doi.org/10.31399/asm.cp.istfa2022p0382
Publikováno v:
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT).
In recent years, flip chip packaging by application of a copper pillar bump as an interconnector within the packages has successfully shrunk the package size to a minimum level, by maintaining or maximizing the chip application functionality. Neverth
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::250b151d76e84e20b2435d63f3638453
https://doi.org/10.1109/iemt.2018.8511764
https://doi.org/10.1109/iemt.2018.8511764
Autor:
Eric Wong Soon Kiong, Chin Yung Lai
Publikováno v:
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT).
Scanning acoustic microcopy (SAM) method with inverted inspection direction has been successfully develop and evaluate the quality of flip chip underfill and interconnect bonds in manufacturing of microelectronic components. Acoustic microscopes util
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d359f107d62f2b6c62dd78cba2f503b
https://doi.org/10.1109/iemt.2018.8511798
https://doi.org/10.1109/iemt.2018.8511798