Zobrazeno 1 - 10
of 126
pro vyhledávání: '"Eric Woirgard"'
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2020, 114, pp.113891-. ⟨10.1016/j.microrel.2020.113891⟩
Microelectronics Reliability, Elsevier, 2020, 114, pp.113891-. ⟨10.1016/j.microrel.2020.113891⟩
This study deals with the reliability of a new power embedded PCB (printed circuit board) concept highly integrated into an electrical machine for aeronautical and automotive applications. The first part of this paper describes the assembly topology.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bf3e8ac73fadc79b197200d294579343
https://hal.archives-ouvertes.fr/hal-03492797
https://hal.archives-ouvertes.fr/hal-03492797
Publikováno v:
Materials Focus. 6:352-358
Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices
Publikováno v:
Microelectronics Reliability. 64:409-414
The eutectic Au80Sn20 solder alloy has been applied in semiconductor assemblies and other industries for years. Due to some superior physical properties, Au/Sn alloy gradually becomes one of the best materials for soldering in electronic devices and
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2018, 88-90, pp.402-405. ⟨10.1016/j.microrel.2018.07.076⟩
Microelectronics Reliability, Elsevier, 2018, 88-90, pp.402-405. ⟨10.1016/j.microrel.2018.07.076⟩
Space and transport industries are facing a strong global competition which is setting economic constraints on the entire supply chain. In order to address decreasing development costs and to propose new features, components-off-the-shelf (COTS) have
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::decad739c954f3e8a2b2d2bab41abbce
https://hal.archives-ouvertes.fr/hal-02499971
https://hal.archives-ouvertes.fr/hal-02499971
Autor:
Omar Chihani, Loic Theolier, Jean-Yves Deletage, Eric Woirgard, Alain Bensoussan, Andre Durier
Publikováno v:
2018 IEEE International Reliability Physics Symposium (IRPS)
2018 IEEE International Reliability Physics Symposium (IRPS), Mar 2018, San-Francisco, United States. pp.P-RT.2-1-P-RT.2-6, ⟨10.1109/irps.2018.8353685⟩
IRPS
2018 IEEE International Reliability Physics Symposium (IRPS), Mar 2018, San-Francisco, United States. pp.P-RT.2-1-P-RT.2-6, ⟨10.1109/irps.2018.8353685⟩
IRPS
This paper investigates the degradation of AlGaN/GaN HEMTs submitted to HTRB and HTGB step-stresses. Steps in terms of temperature and voltage were performed in order to distinguish the effect of each stressor. The main aim is to establish a lifetime
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3153c1bac81d540210b5351f7910ef14
https://hal.archives-ouvertes.fr/hal-02500021
https://hal.archives-ouvertes.fr/hal-02500021
Autor:
Omar Chihani, Loïc Théolier, Alain Bensoussan, Pierre Bondue, Jean-Yves Deletage, André Durier, Eric Woirgard
Publikováno v:
Symposium de Génie Electrique
Symposium de Génie Electrique, Université de Lorraine [UL], Jul 2018, Nancy, France
HAL
Symposium de Génie Electrique, Université de Lorraine [UL], Jul 2018, Nancy, France
HAL
International audience; Des vieillissements par palier de type HTRB et HTGB ont été menés sur des transistors HEMTs de puissance en GaN. Des variations de tension ou de température ont été effectuées afin de mieux comprendre l'effet de chaque
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::dcf56e237d64a815fa23e691688bcda6
https://hal.archives-ouvertes.fr/hal-02981877
https://hal.archives-ouvertes.fr/hal-02981877
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 15:326-334
The thermomechanical behavior of power modules has been always an issue with regard to reliability improvement. Silver sintering technology is one of the few alternatives for die attachment, which could bring a longer operating lifetime. Finite-eleme
Publikováno v:
Microelectronics Reliability. 55:1961-1965
Severe thermal cycles [− 55 °C/+ 245 °C] have highlighted degradations in Active Metal Brazing Si3N4 power substrates with copper metallization, nickel-plated and gold finish. After 1000 thermal cycles, the metallization patterns of the top side
Publikováno v:
Microelectronics Reliability. 55:1981-1987
Thermal cycling induces delamination and causes cyclic strains in a similar way to natural usage and weakens the normal functioning by thermal fatigue. Therefore, such approach can be conveniently used in accelerated testing of components to assess t