Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Eric Nakamura"'
Publikováno v:
2020 IEEE Radiation Effects Data Workshop (in conjunction with 2020 NSREC).
Proton-induced SEE results are reported for the ADC12D1620. Output clock SEU cross sections were measured over a range of proton energies. No SEFI events were observed at 250 MeV to a fluence of 2.0×1011 p/cm2.
Autor:
Nancy Lin, Xiang Zeng, Khanh Thai, Ioulia Smorchkova, Bryan Wu, Reynold Kagiwada, E. Kaneshiro, Monte Watanabe, K. Sato, Dennis Scott, Benjamin Poust, Cedric Monier, David Slavin, Wesley Chan, Augusto Gutierrez-Aitken, Aaron Oki, Peter Cheng, Sujane Wang, Eric Nakamura
Publikováno v:
IEEE Microwave Magazine. 18:60-73
Semiconductor technology has seen rapid advances in recent years. Complementary?metal-oxide-semiconductor (CMOS) technology is providing tremendous digital processing power by integrating billions of transistors. Indium phosphide (InP) has bridged th
Autor:
Eric Nakamura
Publikováno v:
IEEE Communications Magazine. 51:124-129
Compressive sensing offers an alternative to Nyquist sampling in applications where taking a complete set of measurements is impractical due to either length of time required or the volume of data produced. Here we focus on applying compressive sensi
Autor:
Khanh Thai, Nancy Lin, E. Kaneshiro, Kelly Hennig, Reynold Kagiwada, Bert K. Oyama, Greg Chao, Wesley Chan, K. Sato, Augusto Gutierrez-Aitken, Xiang Zeng, Cedric Monier, Dennis W. Scott, Eric Nakamura, Aaron K. Oki, Benjamin Poust, Ioulia Smorchkova
Publikováno v:
2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).
Autor:
Nancy Lin, Ioulia Smorchkova, Reynold Kagiwada, K. Sato, Cedric Monier, Aaron Oki, Wes Chan, Ben Poust, Dino Ferizovic, Xiang Zeng, E. Kaneshiro, Augusto Gutierrez-Aitken, Eric Nakamura, Khanh Thai, Dennis Scott
Publikováno v:
ECS Meeting Abstracts. :2075-2075
The requirements for future systems are increasingly demanding not only form the point of view of performance, but also from size, weight, power and cost (SWAP-C) considerations. This translates into the need for advanced integration of additional co