Zobrazeno 1 - 10
of 38
pro vyhledávání: '"Eric Joubert"'
Autor:
Habib Boulzazen, Chawki Douzi, Eric Joubert, Pascal Dherbécourt, Moncef Kadi, François Fouquet
Publikováno v:
e-Prime: Advances in Electrical Engineering, Electronics and Energy, Vol 2, Iss , Pp 100060- (2022)
Due to the superior physical properties of Wide bandgap (WBG) based power switching devices, silicon carbide (SiC) and gallium nitride (GaN) are believed to be promising candidates to replace Silicon in power electronics converters for EV/HEV applica
Externí odkaz:
https://doaj.org/article/67405fa3eb444b06a5569f6bc06b256d
Publikováno v:
e-Prime: Advances in Electrical Engineering, Electronics and Energy, Vol 2, Iss , Pp 100062- (2022)
This paper reports an evaluation of time to failure (TTF) of GaN transistors for 5G and RADAR applications. The TTF on Arrhenius curves are extrapolated from performed RF pulsed life tests with different input powers and duty cycles. The paper explai
Externí odkaz:
https://doaj.org/article/97449a96f61a4939adecd7ade3123900
Publikováno v:
IET Circuits, Devices & Systems. 14:222-228
In this study, the authors aim at investigating the static electro-thermal behaviour of two new generations of power silicon carbide metal oxide semiconductor field effect transistors (SiC MOSFETs). The studied devices are commercialised and have a v
Publikováno v:
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability, Institute of Electrical and Electronics Engineers, 2019, 19 (4), pp.704-710. ⟨10.1109/TDMR.2019.2950091⟩
IEEE Transactions on Device and Materials Reliability, 2019, 19 (4), pp.704-710. ⟨10.1109/TDMR.2019.2950091⟩
IEEE Transactions on Device and Materials Reliability, Institute of Electrical and Electronics Engineers, 2019, 19 (4), pp.704-710. ⟨10.1109/TDMR.2019.2950091⟩
IEEE Transactions on Device and Materials Reliability, 2019, 19 (4), pp.704-710. ⟨10.1109/TDMR.2019.2950091⟩
This paper presents a method based on IV pulsed characterizations to estimate the junction temperature of AlGaN/GaN high-electron mobility transistors (AlGaN/GaN HEMTs). This technique allows a 2D plan evaluation of the average temperature of the tra
Autor:
Eric Joubert, Niemat Moultif, Christian Moreau, Olivier Latry, Jean-Francois Goupy, Mohamed Ndiaye, Patrick Carton
Publikováno v:
IEEE Transactions on Power Electronics
IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2021, 36 (7), pp.7442-7450. ⟨10.1109/TPEL.2020.3042133⟩
IEEE Transactions on Power Electronics, 2021, 36 (7), pp.7442-7450. ⟨10.1109/TPEL.2020.3042133⟩
IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2021, 36 (7), pp.7442-7450. ⟨10.1109/TPEL.2020.3042133⟩
IEEE Transactions on Power Electronics, 2021, 36 (7), pp.7442-7450. ⟨10.1109/TPEL.2020.3042133⟩
This article reports a reliability study on AlGaN/GaN high-electron-mobility transistors under the RF stress. It shows a stabilization of the gate contact after the aging test. However, the degradation of RF performances and dc parameters is noticed.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2b6df7930b77971edbfe78e70a65c570
https://hal-normandie-univ.archives-ouvertes.fr/hal-03174499
https://hal-normandie-univ.archives-ouvertes.fr/hal-03174499
Publikováno v:
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability, 2020, 20 (3), pp.506-511. ⟨10.1109/TDMR.2020.2999029⟩
IEEE Transactions on Device and Materials Reliability, Institute of Electrical and Electronics Engineers, In press, pp.1-1. ⟨10.1109/TDMR.2020.2999029⟩
IEEE Transactions on Device and Materials Reliability, Institute of Electrical and Electronics Engineers, 2020, 20 (3), pp.506-511. ⟨10.1109/TDMR.2020.2999029⟩
IEEE Transactions on Device and Materials Reliability, 2020, 20 (3), pp.506-511. ⟨10.1109/TDMR.2020.2999029⟩
IEEE Transactions on Device and Materials Reliability, Institute of Electrical and Electronics Engineers, In press, pp.1-1. ⟨10.1109/TDMR.2020.2999029⟩
IEEE Transactions on Device and Materials Reliability, Institute of Electrical and Electronics Engineers, 2020, 20 (3), pp.506-511. ⟨10.1109/TDMR.2020.2999029⟩
The quality of the gate-oxide and Oxide/SiC interfaces is one of the crucial issues in the implementation of silicon carbide (SiC) Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) in the industrial power electronic applications. The main
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5dbe3b5addf973656313632a36d0aedb
https://normandie-univ.hal.science/hal-03174373
https://normandie-univ.hal.science/hal-03174373
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2021, 126, pp.114295. ⟨10.1016/j.microrel.2021.114295⟩
Microelectronics Reliability, 2021, 126, pp.114295. ⟨10.1016/j.microrel.2021.114295⟩
Microelectronics Reliability, Elsevier, 2021, 126, pp.114295. ⟨10.1016/j.microrel.2021.114295⟩
Microelectronics Reliability, 2021, 126, pp.114295. ⟨10.1016/j.microrel.2021.114295⟩
This paper reports a reliability study on two technologies of AlGaN/GaN high-electron mobility transistors (AlGaN/GaN HEMTs) (Device “A” and Device “B”). A failure analysis study is conducted on devices stressed under real operating condition
Publikováno v:
Engineering Failure Analysis
Engineering Failure Analysis, Elsevier, 2017, 81, pp.69-78. ⟨10.1016/j.engfailanal.2017.07.014⟩
Engineering Failure Analysis, 2017, 81, pp.69-78. ⟨10.1016/j.engfailanal.2017.07.014⟩
Engineering Failure Analysis, Elsevier, 2017, 81, pp.69-78. ⟨10.1016/j.engfailanal.2017.07.014⟩
Engineering Failure Analysis, 2017, 81, pp.69-78. ⟨10.1016/j.engfailanal.2017.07.014⟩
This paper presents a reliability study of an AlGaN/GaN high electron mobility transistor (HEMT) by the photon emission (PE) and the spectral photon emission (SPE) techniques. The backside PE analysis of the studied AlGaN/GaN HEMT identifies PE signa
Publikováno v:
International Journal of Information Science & Technology
International Journal of Information Science & Technology, iJIST, 2019
International Journal of Information Science & Technology, 2019, ⟨10.57675/IMIST.PRSM/ijist-v3i1.44⟩
International Journal of Information Science and Technology, Vol 3, Iss 1, Pp 20-25 (2019)
International Journal of Information Science & Technology, iJIST, 2019
International Journal of Information Science & Technology, 2019, ⟨10.57675/IMIST.PRSM/ijist-v3i1.44⟩
International Journal of Information Science and Technology, Vol 3, Iss 1, Pp 20-25 (2019)
This paper aims to model the static behavior of two generations of Silicon carbide Metal Oxide Semiconductor Field Effect Transistors (SiC-MOSFETs) subjected to temperature and input voltage variations. The description of the studied device, its elec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::30b3d0d19a5488c4b9d2ba4c18214ae1
https://hal.archives-ouvertes.fr/hal-02295925
https://hal.archives-ouvertes.fr/hal-02295925
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2019, 100-101, pp.113434. ⟨10.1016/j.microrel.2019.113434⟩
Microelectronics Reliability, 2019, 100-101, pp.113434. ⟨10.1016/j.microrel.2019.113434⟩
Microelectronics Reliability, Elsevier, 2019, 100-101, pp.113434. ⟨10.1016/j.microrel.2019.113434⟩
Microelectronics Reliability, 2019, 100-101, pp.113434. ⟨10.1016/j.microrel.2019.113434⟩
International audience; Reliability studies are fundamental to optimize the use of new emerging technologies such as AlGaN/GaN HEMTs. This paper reports a reliability study on two power amplifiers using AlGaN/GaN HEMT in real operating conditions for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::290aedb437a0742bedf8a82634bfa9a6
https://hal.archives-ouvertes.fr/hal-02380186
https://hal.archives-ouvertes.fr/hal-02380186