Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Eric Janda"'
Autor:
Jenny Yueh, Miguel Garcia Granda, Seung-Bin Yang, Seung Yoon Lee, Elliott McNamara, Ewoud van West, Bart Segers, Yoon-Tae Lee, Se-Ra Jeon, Ali Ghavami, Yutao Gui, Joon-Soo Park, Daniel Park, Koshiba Dakeshi, Frank Staals, Jeongjin Lee, Chan Hwang, Inbeom Yim, Se-Hui Lee, Eric Janda
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIV.
In order to meet the tightened lithography performance requirement for EUV systems, a good on-product focus control with accurate metrology is essential. In this manuscript we report on a novel metrology solution for the EUV on-product focus measurem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c15bb826d524b92a922ae00f30542136
https://doi.org/10.1117/12.2553246
https://doi.org/10.1117/12.2553246
Autor:
Ju Hee Shin, Eric Janda, Cedric Affentauschegg, Young-Seog Kang, Stefan Cornelis Theodorus Van Der Sanden, Young-Sin Choi, YoungSun Nam, Bernd Geh, Jang-Sun Kim, Jan Baselmans, Oh-Sung Kwon, Mariya Ponomarenko, Young Ha Kim, Hunhwan Ha, Rob W. van der Heijden, Daan Slotboom, Umar H. Rizvi
Publikováno v:
SPIE Proceedings.
In this paper we present the limitations of 3rd order distortion corrections based on standard overlay metrology and propose a new method to quantify and correct the cold-lens aberration fingerprint. As a result of continuous shrinking features of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::856be48e3f00f1cd5ac72495099527d4
https://doi.org/10.1117/12.2086938
https://doi.org/10.1117/12.2086938
Autor:
Bernd Geh, Kiho Yang, Eric Janda, Byounghoon Lee, Donggyu Yim, Young-Hong Min, Sungki Park, Kaustuve Bhattacharyya, Jeongsu Park, Taehyeong Lee, Chan-Ho Ryu, Jongsu Lee, Jens Timo Neumann, Kiki Rhe, Chang-Moon Lim
Publikováno v:
SPIE Proceedings.
Typical overlay metrology marks like Box-in-Box or Advanced-Imaging-Marks print surprisingly poor when exposed with extreme off-axis-illumination. This paper analyzes the root-cause for this behavior and establishes a method how to understand and pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6ebf9057c3e51f7e0df5c86f5e9b79e
https://doi.org/10.1117/12.916376
https://doi.org/10.1117/12.916376
Autor:
Vinay Nair, Xu Xie, Eric Janda, Zhongchang Yu, Rafael Aldana, Anton J. deVilliers, Yuan He, Mike Hyatt, Erik Byers, Y. Cao, Tjitte Nooitgedagt, Peter Engblom, Hua-yu Liu, Danielle Hines, Wenjin Shao, Junwei Lu, Chang-Qun Ma, Chris Aquino, Scott L. Light, Jianming Zhou, Ronald Goossens
Publikováno v:
SPIE Proceedings.
Scanner matching based on wafer data has proven to be successful in the past years, but its adoption into production has been hampered by the significant time and cost overhead involved in obtaining large amounts of statistically precise wafer CD dat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bffb74cbf9ed804f30a179b56ea81608
https://doi.org/10.1117/12.848255
https://doi.org/10.1117/12.848255
Autor:
Yuan He, Eric Janda, Jasper Menger, Bernd Geh, Jianming Zhou, Anton J. deVilliers, Erik Byers, Steve Hansen, Mircea Dusa, Peter Engblom
Publikováno v:
SPIE Proceedings.
A top challenge for Photolithographers during a process transfer involving multiple-generation scanners is tool matching. In a more general sense, the task is to ensure that the wafer printing results in the receiving fab will match or even exceed th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf87f8dfa3d5cfa4ac11c3103e28a676
https://doi.org/10.1117/12.816417
https://doi.org/10.1117/12.816417