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pro vyhledávání: '"Eric H. Beckmann"'
Autor:
Roland Hahn, Katherine V. Hawkins, Oliver D. Patterson, Brian W. Messenger, Eric H. Beckmann, R. Takalkar, Xing J. Zhou
Publikováno v:
2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Embedded DRAM will play a much larger part in IBM server microprocessors for new SOI technologies. Etch of a deep trench (DT) into the substrate, which is used to form the capacitor, is a complicated multi-step process. One of the key elements is etc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1463c33054eb4504759fd291c8e9b0c1
https://doi.org/10.1109/asmc.2010.5551433
https://doi.org/10.1109/asmc.2010.5551433
