Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Eric Duchesne"'
Autor:
Papa Momar Souare, Cedrick Bouchard, Eric Duchesne, James Zaccardi, David Pettit, Francois Vachon
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8397f0d25e398705bdf267effd1c4207
https://doi.org/10.1109/ectc51906.2022.00043
https://doi.org/10.1109/ectc51906.2022.00043
Publikováno v:
Microelectronics Reliability. 132:114533
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93cc6b2ede346233a4ad3f83b851553c
https://doi.org/10.1016/j.microrel.2022.114533
https://doi.org/10.1016/j.microrel.2022.114533
Publikováno v:
2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)
2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), May 2020, Dubrovnik, Croatia. pp.1-6, ⟨10.1109/I2MTC43012.2020.9128884⟩
I2MTC
2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), May 2020, Dubrovnik, Croatia. pp.1-6, ⟨10.1109/I2MTC43012.2020.9128884⟩
I2MTC
This paper presents an external analog readout circuit based on frequency response analysis implemented on PCB for the specific use of embedded carbon nanotube (CNT) sensors. The readout architecture based on analog coherent detection technique allow
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e4f8a0ec88e75efc48ded3af4d0aaded
https://hal.archives-ouvertes.fr/hal-02895351
https://hal.archives-ouvertes.fr/hal-02895351
Publikováno v:
Microelectronics Reliability. 128:114431
In a flip chip package, due to the sharp square chip corner geometry and the loading from mismatches in the coefficients of thermal expansion between materials in the assembly, a stress concentration in the chip corner area is often thought to greatl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f97de8edd432794999c90f496ed98cb
https://doi.org/10.1016/j.microrel.2021.114431
https://doi.org/10.1016/j.microrel.2021.114431
Source Separation Using Sensor’s Frequency Response: Theory and Practice on Carbon Nanotubes Sensors
Publikováno v:
Sensors, Vol 19, Iss 15, p 3389 (2019)
Sensors
Sensors, MDPI, 2019, 19 (15), pp.3389. ⟨10.3390/s19153389⟩
Sensors (Basel, Switzerland)
Volume 19
Issue 15
Sensors
Sensors, MDPI, 2019, 19 (15), pp.3389. ⟨10.3390/s19153389⟩
Sensors (Basel, Switzerland)
Volume 19
Issue 15
Nowadays, there is an increased demand in integrated sensors for electronic devices. Multi-functional sensors provide the same amount of data using fewer sensors. Carbon nanotubes are non-selectively sensitive to temperature, gas and strain. Thus, ca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ed664f47b6cc7730765872362ed5d35d
https://www.mdpi.com/1424-8220/19/15/3389
https://www.mdpi.com/1424-8220/19/15/3389
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
A bidirectional solid/fluid coupling methodology developed for natural convection [1], [2] has been applied to the case of forced convection. The two-way coupling methodology is compared when using CFD and empirical formulas to determine the heat tra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc724936dcc857144c78430636d88e52
https://doi.org/10.1109/itherm.2019.8757329
https://doi.org/10.1109/itherm.2019.8757329
Autor:
Benoit Foisy, Bijan Borzou, Julien Sylvestre, Stephanie Allard, Eric Duchesne, Papa Momar Souare, Mamadou Kabirou Toure
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
In order to contribute to a better understanding of the relevant thermal phenomena, we have performed a high precision comparison of a microelectronic package cooled by natural convection with experimental data obtained in the Still Air JEDEC configu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0a415d7b63c3dd24582694862acc70a
https://doi.org/10.1109/estc.2018.8546346
https://doi.org/10.1109/estc.2018.8546346
Autor:
Yosri Ayadi, Quentin Vandier, Aurore Quelennec, Eric Duchesne, Hélène Fremont, Dominique Drouin
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, United States. pp.1639-1644, ⟨10.1109/ECTC.2018.00247⟩
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, United States. pp.1639-1644, ⟨10.1109/ECTC.2018.00247⟩
The interest in very-large-scale integration technology combined with market pressure to reduce materials and process costs introduce new packaging yield and reliability challenges. The use of organic substrates in flip-chip packages, rather than cer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e6c859ed510642c1b7260611f7d225f2
https://hal.archives-ouvertes.fr/hal-02074111
https://hal.archives-ouvertes.fr/hal-02074111
Autor:
Eric Duchesne, David Danovitch, Normand-Pierre Goodhue, Jeff Moussodji Moussodji, Benoit Papineau
Publikováno v:
Electronic Components & Packaging Conference (ECTC) 2018
Electronic Components & Packaging Conference (ECTC) 2018, May 2018, San Diego, United States
Electronic Components & Packaging Conference (ECTC) 2018, May 2018, San Diego, United States
This paper presents work undertaken to investigate a temporary carrier technique to control the warpage of an organic coreless substrate during a flip chip assembly process that exploits the higher throughput technique of mass reflow chip joining. To
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b97f31b8c56d4e4da613cb4e4bbc8160
https://doi.org/10.1109/ectc.2018.00110
https://doi.org/10.1109/ectc.2018.00110
Autor:
Mamadou Kabirou Toure, Benoit Foisy, Stephanie Allard, Eric Duchesne, Julien Sylvestre, Papa Momar Souare
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2018, Toulouse, France. ⟨10.1109/EuroSimE.2018.8369862⟩
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2018, Toulouse, France. ⟨10.1109/EuroSimE.2018.8369862⟩
In order to predict and manage the thermal behavior of microelectronic packages cooled principally by natural convection, a two-way coupling method was developed between a accurate conduction model and a computational fluid dynamics (CFD) simulation.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2af658599ae1f7f2800e28ceb8be89f1
https://doi.org/10.1109/eurosime.2018.8369862
https://doi.org/10.1109/eurosime.2018.8369862