Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Eric Beisser"'
Autor:
Jaime Bravo, Philippe Morey-Chaisemartin, Lifu Chang, Eric Beisser, Frederic Brault, Joshua Zusman
Publikováno v:
DTCO and Computational Patterning II.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::997d9a3326b6c09a258fb151b44db75c
https://doi.org/10.1117/12.2657011
https://doi.org/10.1117/12.2657011
Publikováno v:
Design-Process-Technology Co-optimization XV.
We propose a new method applied on Multi-Project Wafer (MPW) reticles to reduce thermal-mechanical stress. Wafer bumping processes generate residual thermal-mechanical stress, causing crack and delamination across wide regions on a wafer. In this pap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69d361e3d3dd5d5c8b0b574274c197aa
https://doi.org/10.1117/12.2583510
https://doi.org/10.1117/12.2583510
Publikováno v:
Photomask Technology 2019.
This paper addresses large dies stitching challenges. Stitching is a way to combine several shots "stitched together" to create a die larger than what can fit on a photomask. This technique that was originally dedicated to advanced research is now mo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ab39f28245926dd24957b3eccc97efa
https://doi.org/10.1117/12.2536739
https://doi.org/10.1117/12.2536739
Publikováno v:
SPIE Proceedings.
Advanced process photolithography masks require more and more controls for registration versus design and critical dimension uniformity (CDU). The distribution of the measurement points should be distributed all over the whole mask and may be denser
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed30a167fc13baa7c4614aadd82278f9
https://doi.org/10.1117/12.2229185
https://doi.org/10.1117/12.2229185
Publikováno v:
SPIE Proceedings.
Design complexity sometimes grows faster than EDA tools performances, and some innovation should be made on the design flow to guarantee the best possible validation in a reasonable time. This was the challenge we were facing for the final layout val
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e834d564b976905f5eaabd8eb22c160
https://doi.org/10.1117/12.2028657
https://doi.org/10.1117/12.2028657
Publikováno v:
SPIE Proceedings.
Designing a fully new 256 cores processor is a great challenge for a fabless startup. In addition to all architecture, functionalities and timing issues, the layout by itself is a bottleneck due to all the process constraints of a 28nm technology. As
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::34e54660ccf3669d2f79b77d6159cfd1
https://doi.org/10.1117/12.2028314
https://doi.org/10.1117/12.2028314
Publikováno v:
SPIE Proceedings.
Some chip manufacturing steps lead to non-negligible process variation at wafer level. Typically, chemomechanical planarization, known as CMP, is a nonhomogeneous process and thickness variations can be measured depending on the distance from a speci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::237db98d115aabf19c7412e115291c1a
https://doi.org/10.1117/12.898617
https://doi.org/10.1117/12.898617
Autor:
Jean-Claude Marin, Eric Beisser, Pascal Guyader, Philippe Morey-Chaisemartin, Julien Rosa, Lidwine Chaize
Publikováno v:
ISQED
Nowadays, two different methodologies are used to address the CMP issues. On one hand, we find basic design oriented methods consisting of reaching a minimal density of geometries in the design. On the other hand we find model based approaches in whi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9856e1a962dd81194b5d9da39ce6dbd3
https://doi.org/10.1109/isqed.2011.5770759
https://doi.org/10.1109/isqed.2011.5770759
Autor:
Dominique Sadran, Michel Tabusse, Philippe Morey-Chaisemartin, Isabelle Servin, David Au, Stéphane Bonniol, Michel Tissier, Patrick Garcia, Eric Beisser
Publikováno v:
SPIE Proceedings.
The cost of production of a photomask set has been soaring over the last few years, and now reaches $1 million to $2 million, almost 10% of the overall cost of a new project development. And new projects have seen their profitability lifetime reduced
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f525e4ec07ad63e6109e3c98152b95af
https://doi.org/10.1117/12.824273
https://doi.org/10.1117/12.824273