Zobrazeno 1 - 10
of 37
pro vyhledávání: '"Eren Kursun"'
Publikováno v:
Metal-Air Batteries ISBN: 9781003295761
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d747886ffdbfd7808f35d4c915164930
https://doi.org/10.1201/9781003295761-12
https://doi.org/10.1201/9781003295761-12
Autor:
Wei Zhang, Poki Chen, Naehyuck Chang, Eren Kursun, Makoto Nagata, M. Elfadel, Huawei Li, Partha Pratim Pande, Tae-Hyoung Kim, Ioannis Savidis, Houman Homayoun, Krishnendu Chakrabarty, Yuh-Shyan Hwang, Chirn Chye Boon, Patrick Mercier, Shih-Chieh Chang, Arun Natarajan, Chip-Hong Ho, Maxime Baas, Sheldon X.-D. Tan, Said Hamdioui, Mingoo Seok, Mehran Mozaffari Kermani, Aida Todri-Sanial, Koji Nii, Jaydeep P. Kulkarni, Masanori Hashimoto, Tsung-Yi Ho, Pasquale Corsonello, Massimo Alioto, Masud H. Chowdhury, Chulwoo Kim, Meng-Fan Chang, Hai Helen Li, Tanay Tan, Yao-Wen Chang, M. Tehranipoor, Prabhat Mishra, Stacey Weber Jackson, Zhengya Zhang, Rajiv L Joshi, Erik G. Larsson, Jiang Xu, Miroslav N. Velev
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 25:1-20
As I start my second two-year term (2017–2018) as the Editor-in-Chief (EIC) of the IEEE Transactions on Very Large Scale Integration Systems (TVLSI), I wish the TVLSI readership a very happy new year and continued professional success. It gives me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac0580c412083b9bf3d152a5baf420e5
https://doi.org/10.1109/tvlsi.2016.2638578
https://doi.org/10.1109/tvlsi.2016.2638578
Autor:
Eren Kursun, Pavan Kumar Chundi, Martha A. Kim, Seongjong Kim, Teng Yang, Mingoo Seok, Peter R. Kinget
Publikováno v:
MWSCAS
Today's microprocessors and Systems-on-Chip are thermally limited. Many, therefore, employ dynamic thermal management (DTM) to maximize performance under a reliability constraint. Accurate thermal monitoring is critical as temperature underestimation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e2e9282e4ae09961d1cbc2ec9b9a117
https://doi.org/10.1109/mwscas.2017.8052853
https://doi.org/10.1109/mwscas.2017.8052853
Publikováno v:
ISLPED
This paper presents analysis and evaluation of the impact of size and voltage scalability of on-chip temperature sensor on the accuracy of hotspot monitoring and temperature estimation in dynamic thermal management of high performance microprocessors
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f7715b08b7dbe8f9a503fdf0c1873c5
https://doi.org/10.1109/islped.2017.8009191
https://doi.org/10.1109/islped.2017.8009191
Publikováno v:
ACM Great Lakes Symposium on VLSI
Existing works on Three-dimensional (3D) hardware security focus on leveraging the unique 3D characteristics to address the supply chain attacks that exist in 2D design. However, 3D ICs introduce specific and unexplored challenges as well as new oppo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de05347f1aa8b44e82c8d3752894dd5e
https://doi.org/10.1145/3060403.3060500
https://doi.org/10.1145/3060403.3060500
Publikováno v:
ACM Journal on Emerging Technologies in Computing Systems. 9:1-22
Improving the vulnerability to soft errors is one of the important design goals for future architecture design of Chip-MultiProcessors (CMPs). In this study, we explore the soft error characteristics of CMPs with 3D stacked NonVolatile Memory (NVM),
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3c8ec7488fc05f2312dcc53b7f4472a
https://doi.org/10.1145/2491679
https://doi.org/10.1145/2491679
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 32:1335-1346
3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal conductivity in t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc92547f20043ab827bba935cdb011e1
https://doi.org/10.1109/tcad.2013.2261120
https://doi.org/10.1109/tcad.2013.2261120
Publikováno v:
ICCD
Side-channel attacks are important security challenges as they reveal sensitive information about on-chip activities. Among such attacks, the thermal side-channel has been shown to disclose the activities of key functional blocks and even encryption
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5616f025b065009a5fd8a50510979288
https://doi.org/10.1109/iccd.2016.7753336
https://doi.org/10.1109/iccd.2016.7753336
Publikováno v:
ACM Great Lakes Symposium on VLSI
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks, hardware tro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa305759c78542e2fd7bcb52dc0c739f
https://doi.org/10.1145/2902961.2903512
https://doi.org/10.1145/2902961.2903512
Publikováno v:
ACM Journal on Emerging Technologies in Computing Systems. 8:1-17
Three-dimensional integration provides a new way of performance growth for microprocessor architectures. While a recent studies report promising performance improvement numbers, majority of the processor stacking options are thermally-limited. Elevat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30aba001b7bd19bcdd6238f55b575f25
https://doi.org/10.1145/2287696.2287704
https://doi.org/10.1145/2287696.2287704