Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Erdong, Song"'
Autor:
Daeyoung Kong, Yunseo Kim, Minsoo Kang, Erdong Song, Yongtaek Hong, Han Sang Kim, Kyupaeck Jeff Rah, Hyoung Gil Choi, Damena Agonafer, Hyoungsoon Lee
Publikováno v:
Case Studies in Thermal Engineering, Vol 28, Iss , Pp 101583- (2021)
Manifold microchannel heat sinks (MMCHSs) have attracted attention for the thermal management of high-performance electronics owing to their high heat dissipation rate and low pressure drop compared to conventional microchannels. This study used a fu
Externí odkaz:
https://doaj.org/article/0dd9e38173834607b8a89d5edcc9d99a
Autor:
Erdong, Song, author, Huilin, Sun, author
Publikováno v:
The China Society Yearbook, Volume 3. :97-107
Autor:
Erdong, Song, author, Congbin, Yan, author
Publikováno v:
The China Society Yearbook, Volume 2. :151-159
Publikováno v:
ACS Omega, Vol 4, Iss 5, Pp 9376-9382 (2019)
Externí odkaz:
https://doaj.org/article/a11b1e1d451e4acc94c97d0d854eb80e
Autor:
Erdong Song, Andrei Baranovskiy, Enzhi Xu, Tito Busani, Brian Swartzentruber, Shixiong Zhang, Yaron Amouyal, Julio A. Martinez
Publikováno v:
AIP Advances, Vol 8, Iss 10, Pp 105010-105010-8 (2018)
Decoupling the electronic thermal and electrical conductivities is one of the limitations hindering a breakthrough in thermoelectric efficiency. After a conformal surface coating of bismuth telluride nanowires (Bi2Te3 NWs) by porphyrins, the thermal
Externí odkaz:
https://doaj.org/article/6c658a890c674f67aad46456eb9ddd29
Publikováno v:
ACS Applied Nano Materials. 4:4419-4431
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::377a9e3b9867099239d0255bfa8826d2
https://doi.org/10.1021/acsanm.0c03472
https://doi.org/10.1021/acsanm.0c03472
Autor:
Vivek V. Manepalli, Kidus Guye, Erdong Song, Alex Dutton, Daniel Luberda, Quan Chau, Yousof Nayfeh, Troy Beechner, Sean H. Hoenig, Michael C. Ellis, Damena D. Agonafer
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a319f8dce65171e2609665f700204170
https://doi.org/10.1109/itherm54085.2022.9899677
https://doi.org/10.1109/itherm54085.2022.9899677
Autor:
Yunseo Kim, Min-Soo Kang, Yongtaek Hong, Hyoungsoon Lee, Damena Agonafer, Daeyoung Kong, Hyoung Gil Choi, Kyupaeck Jeff Rah, Erdong Song, Han Sang Kim
Publikováno v:
Case Studies in Thermal Engineering, Vol 28, Iss, Pp 101583-(2021)
Manifold microchannel heat sinks (MMCHSs) have attracted attention for the thermal management of high-performance electronics owing to their high heat dissipation rate and low pressure drop compared to conventional microchannels. This study used a fu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::78c829581fc26334a75bdf9ebc2edc2a
http://www.sciencedirect.com/science/article/pii/S2214157X21007462
http://www.sciencedirect.com/science/article/pii/S2214157X21007462
Autor:
Jia-yu Bi, Wang Wei, Yalin Wu, Zhiqiang Shao, Erdong Song, Sun Zhiqiang, Zhiyuan Liu, Chaozhu Zhang
Publikováno v:
Optics express. 29(13)
In this paper, we proposed an all-sapphire-based extrinsic Fabry-Perot interferometer (EFPI) sensor based on wet etching and the direct bonding process. Temperature measured by the EFPI is used to calibrate pressure measurement. The problem of repeat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::22ce91e7e097e3a9500011f4c20b6ccc
https://pubmed.ncbi.nlm.nih.gov/34266085
https://pubmed.ncbi.nlm.nih.gov/34266085
Autor:
Zhiyuan Liu, Zhiqiang Shao, Meiyu Yan, Shuang Wang, Erdong Song, Yalin Wu, Ying-Qi Shang, Chaozhu Zhang, Sun Zhiqiang
Publikováno v:
Optics Express. 29:4139
In this paper, we proposed an all-sapphire-based extrinsic Fabry-Perot interferometer (EFPI) pressure sensor based on an optimized wet etching process, aiming to improve the quality of the interference signal. The sapphire pressure sensitive diaphrag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::29de32a1c46c13bf364cfaa3b578e8db
https://doi.org/10.1364/oe.417246
https://doi.org/10.1364/oe.417246