Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Erdem Ultanir"'
Particle standard is important and widely used for calibration of inspection tools and process characterization and benchmarking. We have developed a method for generating and classifying monodisperse particles of different materials with a high degr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c8b0343b2819d3fba4a56ac581af0590
https://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&origin=inward&scp=67149120127
https://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&origin=inward&scp=67149120127
Autor:
Pei-yang Yan, Barry Lieberman, Ted Liang, Emily Y. Shu, Seh-Jin Park, Guojing Zhang, Ping Qu, Alan R. Stivers, Gilroy Vandentop, Sven Henrichs, Erdem Ultanir, Peter Sanchez
Publikováno v:
SPIE Proceedings.
Extreme ultraviolet lithography (EUVL) tool development achieved a big milestone last year as two full-field Alpha Demo Tools (ADT) were shipped to customers by ASML. In the future horizon, a full field "EUV1" exposure tool from Nikon will be availab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a24a465211f12bfefb302d0bae38c4db
https://doi.org/10.1117/12.728941
https://doi.org/10.1117/12.728941
Autor:
Eberhard Spiller, Paul B. Mirkarimi, Farhad Salmassi, Patrick P. Naulleau, Erdem Ultanir, Ted Liang, Sherry L. Baker, Seh-Jin Park, Guojing Zhang, Eric M. Gullikson, Erik H. Anderson
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 25:2098
The ability to fabricate defect-free reflective Mo–Si multilayer (ML) blanks is a well-recognized challenge in enabling extreme ultraviolet (EUV) lithography for semiconductor manufacturing. Both the specification and reduction of defects necessita
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf5d99a2f82b8a7920acb44401102dd3
https://doi.org/10.1116/1.2779044
https://doi.org/10.1116/1.2779044