Zobrazeno 1 - 4
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pro vyhledávání: '"Er Hao Chen"'
Publikováno v:
Computers, Materials & Continua. 73:935-952
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publikováno v:
Thirteenth International Conference on Digital Image Processing (ICDIP 2021).
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this work, a new integrated substrate structure “2.2D” is demonstrated. 2.2D substrate is a true die last solution. This solution used thin film RDL directly bonded to the substrate. This simplifies the 2.5D structure and further reduces the c