Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Eng Chuan Low"'
Autor:
Osama Shana'a, Ying Chow Tan, Tieng Ying Choke, Liming Jin, Weimin Shu, Huajiang Zhang, Hon Cheong Hor, Junmin Cao, Eng Chuan Low, Chin Heng Leow
Publikováno v:
2017 IEEE Radio Frequency Integrated Circuits Symposium (RFIC).
For compact integration of 13.56MHz NFC functionality in mobile devices, a small planar loop antenna is a necessity. Active load modulation (ALM) is a commonly adopted technique to boost load modulation amplitude to overcome weak inductive coupling i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1750b39a105de24eb328fc6a029e992a
https://doi.org/10.1109/rfic.2017.7969063
https://doi.org/10.1109/rfic.2017.7969063
Autor:
Ying Chow Tan, Weimin Shu, Geok Teng Ong, Wee Guan Tan, Osama Shana'a, Huajiang Zhang, Chin Heng Leow, Dan Ping Li, Soong Lin Chew, Ming Kong, Tian Bao Gao, Liming Jin, Chee Lee Heng, Wee Liang Lien, Uday Dasgupta, Eng Chuan Low, Tieng Ying Choke, Yong Chee Hong
Publikováno v:
ISSCC
The popularity of the Near-Field Communication (NFC) system stems from being able to establish communication by merely being in the vicinity of another NFC device, an operation known as “tap and go”. An NFC device is quite complex: it has to supp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::439155fb067cc84061f54d2dbcb80f5f
https://doi.org/10.1109/isscc.2014.6757380
https://doi.org/10.1109/isscc.2014.6757380
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 48:209-213
A plastic package GaAs MESFET receiver front-end monolithic microwave integrated circuit operating at 5.8 GHz is presented in this paper. It has a two-stage low-noise amplifier followed by a dual-gate mixer. Operating at 3 V and 8.3 mA, a conversion
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::234d617bcf34f4bf2dacab6f317c58e1
https://doi.org/10.1109/22.821763
https://doi.org/10.1109/22.821763
Autor:
Jhy-Rong Chen, Yuan Sun, Jing-Hong Conan Zhan, Hsuan-Yu Liu, Chih-Fan Liao, Min Chen, Chihun Lee, Kuo-Hao Chen, Chia-Jui Hsu, Wei-Kai Hong, Sheng-Jau Wong, Yu-Li Hsueh, Chunwei Chang, Hong-Kai Hsu, Osama Shana'a, Hong-Lin Chu, Chao-Hsin Lu, Eng Chuan Low, Deyong Hu, Guang-Kaai Dehng, George Chien, Kuan Chien-Wei, Yi-Hsien Cho, Weimin Shu, Chih-Hsien Shen, Yuan-Hung Chung, Jui-Lin Hsu, Tsung-Ming Chen, Li-Chun Ko, Jie-Wei Lai, Xudong Jiang
Publikováno v:
ISSCC
In recent years, the increasing popularity of mobile devices, such as smart-phones and tablets, is driving the demand for integrating multiple radios on a single SoC to reduce cost, form factor and external BOM [1]. These devices require ubiquitous w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::804e05f763d4d6a7c48defc4f98e2bef
https://doi.org/10.1109/isscc.2012.6176964
https://doi.org/10.1109/isscc.2012.6176964
Autor:
Cheah, J., Kwek, E.-H., Eng Chuan Low, Chee Kwang Quek, Yong, C., Enright, R., Hirbawi, J., Lee, A., Hongyu Xie, Longyin Wei, Le Luong, Jianping Pan, Shih-Tsung Yang, Lau, W.F.A., Wai-Lim Ngai
Publikováno v:
2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315); 2002, p68-403, 336p
Autor:
J. Cheah, E.-H. Kwek, null Eng Chuan Low, null Chee Kwang Quek, C. Yong, R. Enright, J. Hirbawi, A. Lee, null Hongyu Xie, null Longyin Wei, null Le Luong, null Jianping Pan, null Shih-Tsung Yang, W.F.A. Lau, null Wai-Lim Ngai
Publikováno v:
2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::25115087721075c5f306805a42ad4769
https://doi.org/10.1109/isscc.2002.992113
https://doi.org/10.1109/isscc.2002.992113
Autor:
Ee-Hong Kwek, Jonathon Y. Cheah, J. Hirbawi, Longyin Wei, W.F.A. Lau, Eng Chuan Low, R. Enright, Shih-Tsung Yang, Le Luong, Chee Kwang Quek, Hongyu Xie, Jianping Pan, Yong Chee Hong, Wai-Lim Ngai, A. Lee
Publikováno v:
2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315).
A complete 0.25 /spl mu/m CMOS SOC Bluetooth solution adopts a two-die in a single MCM chip packaging approach with minimum product cost as the most important design goal while maintaining competitive power consumption and RF performance.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8533717dd44fb3a7436fc945b3be3f71
https://doi.org/10.1109/isscc.2002.992953
https://doi.org/10.1109/isscc.2002.992953
Publikováno v:
1999 IEEE Radio Frequency Integrated Circuits Symposium (Cat No.99CH37001).
A plastic package GaAs MESFET receiver front-end MMIC operating at 5.8 GHz is presented. It has a two stage LNA followed by a dual-gate mixer. Operating at 3 V and 8.3 mA, CG of 20.4 dB, NF of 4.1 dB, and high port-to-port isolations have been achiev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d147829d83c24db82a1b25012ee6b87
https://doi.org/10.1109/rfic.1999.805236
https://doi.org/10.1109/rfic.1999.805236
Publikováno v:
1999 IEEE Radio Frequency Integrated Circuits Symposium (Cat No99CH37001); 1999, p43-46, 4p
Autor:
Eng Chuan Low, Yan, Kelvin
Publikováno v:
IEEE Transactions on Microwave Theory & Techniques; Feb2000, Vol. 48 Issue 2, p209, 5p, 2 Black and White Photographs, 7 Diagrams, 1 Chart, 9 Graphs