Zobrazeno 1 - 3
of 3
pro vyhledávání: '"En-Hsiang Yeh"'
Autor:
Victor C. Y. Chang, C. S. Liu, Jeng-Shien Hsieh, Feng Wei Kuo, Doug C. H. Yu, Hao-Yi Tsai, En-Hsiang Yeh, Chih-Hua Chen, Chewn-Pu Jou, Ron Chen, Ying-Ta Lu, Hsu-Hsien Chen, Chuei-Tang Wang
Publikováno v:
3DIC
An integration of 28 nm CMOS RF system with 3D solenoidal inductors (3DSI) in integrated fan-out (InFO) wafer level package technology is studied. The 3DSI provides the performance of Q-factor of 51 and isolation of −53 dB. With the 3DSI, the RF sy
Autor:
Chung-Shi Liu, En-Hsiang Yeh, Monsen Liu, Jeng-Shien Hsieh, Ching-Wen Hsiao, Chuei-Tang Wang, Chung-Hao Tsai, Doug C. H. Yu, Chen-Shien Chen, Hsu-Hsien Chen, Mirng-Ji Lii
Publikováno v:
2013 IEEE International Electron Devices Meeting.
Array antenna integrated with RF chip using InFO-WLP technology is proposed for millimeter wave system applications. Aperture-coupled patch antenna is designed on the fan-out molding compound (MC). The performance of single-element antenna is evaluat
Autor:
En-Hsiang Yeh, Cheng-chieh Hsieh, John Yeh, Shang-Yun Hou, Jing-Cheng Lin, Ming-Yen Chiu, Shin-puu Jeng, Chewn-Pu Jou, Douglas Yu, Chuei-Tang Wang, Li-Hsien Huang, Tzu-Jin Yeh, Chen Shuo-Mao, Huan-Neng Chen, Jui-Pin Hung, Tsung-Shu Lin, Feng Wei Kuo, Christianto Chih-Ching Liu
Publikováno v:
2012 International Electron Devices Meeting.
Integrated fan-out wafer-level packaging (InFO-WLP) technology with state-of-the-art inductors (quality factor of 42 and self-resonance frequency of 16 GHz) has been demonstrated for heterogeneous integration of digital and radio frequency (RF) syste