Zobrazeno 1 - 8
of 8
pro vyhledávání: '"En-Hsiang Yeh"'
Autor:
Victor C. Y. Chang, C. S. Liu, Jeng-Shien Hsieh, Feng Wei Kuo, Doug C. H. Yu, Hao-Yi Tsai, En-Hsiang Yeh, Chih-Hua Chen, Chewn-Pu Jou, Ron Chen, Ying-Ta Lu, Hsu-Hsien Chen, Chuei-Tang Wang
Publikováno v:
3DIC
An integration of 28 nm CMOS RF system with 3D solenoidal inductors (3DSI) in integrated fan-out (InFO) wafer level package technology is studied. The 3DSI provides the performance of Q-factor of 51 and isolation of −53 dB. With the 3DSI, the RF sy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9662d9d155b6ef1cb8e138ba1ce90f0
https://doi.org/10.1109/3dic.2015.7334573
https://doi.org/10.1109/3dic.2015.7334573
Autor:
Chung-Shi Liu, En-Hsiang Yeh, Monsen Liu, Jeng-Shien Hsieh, Ching-Wen Hsiao, Chuei-Tang Wang, Chung-Hao Tsai, Doug C. H. Yu, Chen-Shien Chen, Hsu-Hsien Chen, Mirng-Ji Lii
Publikováno v:
2013 IEEE International Electron Devices Meeting.
Array antenna integrated with RF chip using InFO-WLP technology is proposed for millimeter wave system applications. Aperture-coupled patch antenna is designed on the fan-out molding compound (MC). The performance of single-element antenna is evaluat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f24c7397624ab8f65cd58e6369ec3cc9
https://doi.org/10.1109/iedm.2013.6724687
https://doi.org/10.1109/iedm.2013.6724687
Autor:
En-Hsiang Yeh, Cheng-chieh Hsieh, John Yeh, Shang-Yun Hou, Jing-Cheng Lin, Ming-Yen Chiu, Shin-puu Jeng, Chewn-Pu Jou, Douglas Yu, Chuei-Tang Wang, Li-Hsien Huang, Tzu-Jin Yeh, Chen Shuo-Mao, Huan-Neng Chen, Jui-Pin Hung, Tsung-Shu Lin, Feng Wei Kuo, Christianto Chih-Ching Liu
Publikováno v:
2012 International Electron Devices Meeting.
Integrated fan-out wafer-level packaging (InFO-WLP) technology with state-of-the-art inductors (quality factor of 42 and self-resonance frequency of 16 GHz) has been demonstrated for heterogeneous integration of digital and radio frequency (RF) syste
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08a6cdbb29a58afdf56ee27ef44ca5c4
https://doi.org/10.1109/iedm.2012.6479039
https://doi.org/10.1109/iedm.2012.6479039
Publikováno v:
2015 International 3D Systems Integration Conference (3DIC); 2015, p1-6, 6p
Publikováno v:
2015 International 3D Systems Integration Conference (3DIC); 2015, p8-20, 13p
Autor:
Yu, Doug C. H.
Publikováno v:
Proceedings of the IEEE 2014 Custom Integrated Circuits Conference; 2014, p1-6, 6p
Autor:
Wang, Chuei-Tang, Hsieh, Jeng-Shien, Chang, Victor C. Y., Yeh, En-Hsiang, Kuo, Feng-Wei, Chen, Hsu-Hsien, Chen, Chih-Hua, Chen, Ron, Lu, Ying-Ta, Jou, Chewn-Pu, Tsai, Hao-Yi, Liu, C. S., Yu, Doug C. H.
Publikováno v:
2015 International 3D Systems Integration Conference (3DIC); 2015, pTS6.3.1-TS6.3.4, 0p
Publikováno v:
2014 IEEE International Reliability Physics Symposium; 2014, p4C.3.1-4C.3.4, 0p