Zobrazeno 1 - 10
of 104
pro vyhledávání: '"Emre Salman"'
Publikováno v:
Sensors, Vol 23, Iss 4, p 2081 (2023)
In this paper, first, a broad overview of existing covert channel communication-based security attacks is provided. Such covert channels establish a communication link between two entities that are not authorized to share data. The secret data is enc
Externí odkaz:
https://doaj.org/article/a9ff49717aba4b51925726e80ced8557
Autor:
Emre Salman, Qi Qi
Publikováno v:
Journal of Low Power Electronics and Applications, Vol 1, Iss 1, Pp 131-149 (2011)
A methodology is proposed to design low leakage registers by considering the type of timing path, i.e., short or long, and type of register, i.e., launching or capturing. Three different dual threshold voltage registers are developed where each regis
Externí odkaz:
https://doaj.org/article/136c450509334db3a0176a4ca461b6ee
Autor:
Emre Salman, Krithika Dhananjay
Publikováno v:
IEEE Internet of Things Journal. 10:1112-1123
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 30:1654-1667
Publikováno v:
Proceedings of the Great Lakes Symposium on VLSI 2023.
Autor:
Ryan Willing, Milutin Stanacevic, Emre Salman, Nabid Aunjum Hossain, Manav Jain, Shahrzad Towfighian
Publikováno v:
IEEE Sens J
There has been a significant increase in the number of total knee replacement (TKR) surgeries over the past few years, particularly among active young and elderly people suffering from knee pain. Continuous and optimal monitoring of the load on the k
Autor:
Emre Salman, Ivan Miketic
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 29:1285-1296
This article focuses on thwarting reverse-engineering attacks and intellectual property (IP) theft by leveraging charge-recycling adiabatic circuits. The adiabatic circuit operation has recently received attention for the Internet-of-Things (IoT) app
Autor:
Emre Salman
Publikováno v:
Proceedings of the Great Lakes Symposium on VLSI 2022.
Publikováno v:
Dhananjay, K, Shukla, P, Pavlidis, V, Coskun, A & Salman, E 2020, ' Monolithic 3D Integrated Circuits: Recent Trends and Future Prospects ', IEEE Transactions on Circuits and Systems II: Express Briefs .
Monolithic 3D integration technology has emerged as an alternative candidate to conventional transistor scaling. Unlike conventional processes where multiple metal layers are fabricated above a single transistor layer, monolithic 3D technology enable
Publikováno v:
2022 IEEE International Symposium on Circuits and Systems (ISCAS).