Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Emmanuel Gourvest"'
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
For all applications where a semiconductor device is used, there is a demand for improved performance under all environmental conditions. One such application, which is in regular use, is the smartcard chip that is found predominantly in bank or trav
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6d9a67a8ff3bb85d439793f7a802a51
https://doi.org/10.1109/ectc.2019.00072
https://doi.org/10.1109/ectc.2019.00072
Autor:
Maurice Rivoire, Catherine Euvrard, Aurelien Seignard, Emmanuel Gourvest, Sebastien Gaillard, V. Balan
Publikováno v:
Proceedings of International Conference on Planarization/CMP Technology 2014.
Beyond C14nm, better W CMP performances are required due to new CMOS integration constraints such as contact density increase, wide W feature introduction or low oxide loss for any polishing steps related to gate building. In order to address these n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::780fb41f80f0d4b6dafb6e10dae7f3e8
https://doi.org/10.1109/icpt.2014.7017237
https://doi.org/10.1109/icpt.2014.7017237
Publikováno v:
2015 International Conference on Planarization/CMP Technology (ICPT); 1/1/2015, p1-4, 4p
Publikováno v:
Proceedings of International Conference on Planarization/CMP Technology 2014; 2014, p1-7, 7p
Autor:
Euvrard, Catherine, Seignard, Aurelien, Balan, Viorel, Gourvest, Emmanuel, Gaillard, Sebastien, Rivoire, Maurice
Publikováno v:
Proceedings of International Conference on Planarization/CMP Technology 2014; 2014, p25-28, 4p
Publikováno v:
Proceedings of International Conference on Planarization/CMP Technology 2014; 2014, p1-8, 8p