Výsledky vyhledávání - "Emma Litterio"

Lowering the photoresist swing effect to increase the lithographic critical dimension uniformity: one step ahead in perfecting the dual damascene module

Autor: Valentina Dall'Asta, Emma Litterio, Nicoletta Corneo, Bertrand Le-Gratiet, Tito F. Bellunato

Publikováno v: Advances in Patterning Materials and Processes XXXIX.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::acaa772467db1c1d0992e19f9c41d994
https://doi.org/10.1117/12.2614005

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Chemistry working for lithography: the Marangoni-effect-based single layer for enhanced planarization

Autor: Nicoletta Corneo, Eusebio Barozzi, Jonathan Jeauneau, Emma Litterio, Jakub Koza, Chiara Bertarelli, Tito Flavio Bellunato, Valentina Dall'Asta

Publikováno v: Advances in Patterning Materials and Processes XXXVIII.

In the field of semiconductor manufacturing, there is still a continuous search for techniques to improve the Critical Dimension Uniformity (CDU) across the wafer. CDU improvement and general defectiveness reduction increase the industrial yield and

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::adfa528018cc896ca52f7da433d2e398
https://doi.org/10.1117/12.2583933

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Marangoni effect-based under-layer for a Dual Damascene via-first approach: a scalable solution to the unwanted photoresist swing effect

Autor: Jonathan Jeauneau, Pietro Cantu, Nicoletta Corneo, Valentina Dall'Asta, Emma Litterio, Jakub Koza

Publikováno v: Advances in Patterning Materials and Processes XXXVII.

One of the main challenges of a Dual Damascene (DD) via-first process is the control of the Critical Dimensions (CDs) in the lithography of the trenches. The PhotoResist (PhR) thickness presents variations from the via arrays to the open areas, which

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5e5c78d213fcfe444dee1ccc246f9510
https://doi.org/10.1117/12.2551864

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Experimental study of the strong halation-effect of a fully PGMEA-based under-layer on a highly etched topography in the dual damascene via-first approach

Autor: Pietro Cantu, Nicoletta Corneo, Emma Litterio, Valentina Dall'Asta

Publikováno v: Design-Process-Technology Co-optimization for Manufacturability XIII.

In the preparation of Integrated Circuits (ICs), employing the Dual Damascene (DD) via-first approach, the fulfilling of extremely deep via and, in general, of highly etched structures, still remains a challenging task. Especially, if this is combine

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::21b4f156bf4677aeaf4a3ff3dec7422d
https://doi.org/10.1117/12.2514722

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Characterization of metal line-width variation in via first dual-damascene approach and its modeling using machine learning artificial neural network algorithms

Autor: Alessandro Dundulachi, Valeria Mantovani, Pietro Cantu, Matteo Patelmo, Benedetta Triulzi, Nicoletta Corneo, Chiara Catarisano, Emma Litterio

Publikováno v: Design-Process-Technology Co-optimization for Manufacturability XII.

Line patterning, in via first dual damascene approach, is conditioned by vias density: bottom anti–reflective coating (BARC), used to minimize thin film interference effects by reducing reflected light, and photoresist reflow into vias, leading to

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::9134a56e3b20a564bbee1cb8663f10d8
https://doi.org/10.1117/12.2297256

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