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pro vyhledávání: '"Emma Hsieh"'
Autor:
Chih-Pin Hung, Ding-Bang Luh, Ho-Ming Tong, Colin Liu, Emma Hsieh, Yi-Shao Lai, Shin-Hua Chao
Publikováno v:
Journal of the Chinese Institute of Engineers. 37:827-832
Flip-chip chip-scale packaging (FCCSP) has recently emerged as a package solution achieving superior performance over traditional wire-bonding technology. There are also further possible advances for the assembly process such as under-fill and moldin
Publikováno v:
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Flip-Chip Chip-Scale Packaging (FCCSP) has recently emerged as one of mainstream package solutions due to the superior performance & miniaturization over the wire-bonding technology. There had been lots of efforts to enhance the assembly process effi