Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Emilien Feuillet"'
Autor:
Jean-Marc Heintz, Emilien Feuillet, Jean-François Silvain, Loic Constantin, S. Bordère, Lionel Teule-Gay, Jean Luc Diot, Yongfeng Lu, Renaud de Langlade
Publikováno v:
ACS Applied Electronic Materials
ACS Applied Electronic Materials, American Chemical Society, 2021, 3 (2), pp.921-928. ⟨10.1021/acsaelm.0c01040⟩
ACS Applied Electronic Materials, American Chemical Society, 2021, 3 (2), pp.921-928. ⟨10.1021/acsaelm.0c01040⟩
International audience; Developing solder joints capable of withstanding high power density, high temperature, and significant thermomechanical stress is essential to further develop electronic device performances. This study demonstrates an effectiv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1c15bf86bce26a504bff733f822e1ae6
http://hdl.handle.net/20.500.12278/109614
http://hdl.handle.net/20.500.12278/109614
Publikováno v:
Metallurgical and Materials Transactions B
Metallurgical and Materials Transactions B, Springer Verlag, 2018, 49 (6), pp.3343-3356. ⟨10.1007/s11663-018-1391-8⟩
Metallurgical and Materials Transactions B, Springer Verlag, 2018, 49 (6), pp.3343-3356. ⟨10.1007/s11663-018-1391-8⟩
International audience; Transient Liquid Phase (TPL) bounding of Sn foil sandwiched between two Cu foils involves, in the temperature range above the melting point of Sn (232 °C) and below 350 °C, the formation and the growth of two intermetallic c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c9e436338b094b49ab57f5da1bcfab0c
http://hdl.handle.net/20.500.12278/16103
http://hdl.handle.net/20.500.12278/16103
Autor:
Bruno Mortaigne, Jean-François Silvain, Loic Constantin, Mengmeng Wang, Clio Azina, Pierre-Marie Geffroy, Yongfeng Lu, Emilien Feuillet
Publikováno v:
Surface and Coatings Technology
Surface and Coatings Technology, Elsevier, 2017, 321, pp.1-7. ⟨10.1016/j.surfcoat.2017.04.037⟩
Surface and Coatings Technology, Elsevier, 2017, 321, pp.1-7. ⟨10.1016/j.surfcoat.2017.04.037⟩
International audience; Diamond coatings are investigated for thermal management, wear protection and corrosion resistance in harsh environments. In power electronic industries, copper (Cu), which shows high thermal conductivity, is considered as a p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b5b1ded6b88fd41f2b7975a61302f78c
https://hal.archives-ouvertes.fr/hal-01531340/document
https://hal.archives-ouvertes.fr/hal-01531340/document
Autor:
Thomas Guillemet, Jean-Marc Heintz, Emilien Feuillet, Hiroki Kurita, Akira Kawasaki, Jean-François Silvain
Publikováno v:
Acta Metallurgica Sinica
Acta Metallurgica Sinica, 2014, 27 (4), pp.714-722. ⟨10.1007/s40195-014-0106-7⟩
Acta Metallurgica Sinica, 2014, 27 (4), pp.714-722. ⟨10.1007/s40195-014-0106-7⟩
International audience; The constant increase in power and heat flux densities encountered in electronic devices fuels a rising demand for lightweight heat sink materials with suitable thermal properties. In this study, discontinuous pitch-based carb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d9fd92df93dceb895ac9d64a376cd645
https://doi.org/10.1007/s40195-014-0106-7
https://doi.org/10.1007/s40195-014-0106-7
Autor:
Fabrizio Evangelista, Emilien Feuillet, Arun Kumar Gnanappa, Nina Vladimirovna Dziomkina, Michel Riepen, Evangelos Gogolides
Publikováno v:
SPIE Proceedings.
Failure of the receding meniscus during immersion lithography is one of the well known problems. A thin liquid film left behind on the wafer during scanning may generate imaging defects. Liquid loss occurs at the receding meniscus when the smooth sub
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d377c1f4cc3d4f9fdc0360a549844b0c
https://doi.org/10.1117/12.881605
https://doi.org/10.1117/12.881605