Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Emad S Al-Momani"'
Publikováno v:
Materials Research Express, Vol 11, Iss 7, p 075005 (2024)
In this study, three critical parameters that influence the effective composite properties of Carbon nanoparticles were tested and modeled using finite elements through Digimat Finite Element Analysis (FEA) software, employing representative volume e
Externí odkaz:
https://doaj.org/article/0c8015cb31b945559af995155b491ee6
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
As the data rate of Low Power Double Data Rate 4 (LPDDR4) memory is reaching higher speeds, it is becoming more crucial to evaluate and assess the electrical performance of the viable socket technologies in the market. This paper presents a signal in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::842fae5a8abc9e6a1ed9a5f464b196be
https://doi.org/10.1109/eptc47984.2019.9076717
https://doi.org/10.1109/eptc47984.2019.9076717
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
This paper discusses the electrical characterization and modeling of gripper-type single-sided socket technology to evaluate its performance for high-speed signal applications. The socket was simulated and characterized for multi-ports at high freque
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0cb86524c27444a8b73aa99a42ec69c
https://doi.org/10.1109/eptc47984.2019.9076728
https://doi.org/10.1109/eptc47984.2019.9076728
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 16:532-540
For many microelectronic products, the long-term in-field life may be limited by thermal-mismatch-induced fatigue, a factor generally assessed by accelerated thermal cycling and extrapolation of the test results to in-field use conditions. For this p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::596697d39f4e6cbc14f51b2e1f7d76d1
https://doi.org/10.1109/tdmr.2016.2606884
https://doi.org/10.1109/tdmr.2016.2606884
Autor:
Emad S. Al-Momani
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
The electronics industry is switching the majority of their mobile roadmaps to Ball Grid Array (BGA) packages in order to enable thinner form factor devices. Original Equipment Manufacturers (OEMs) have to solder down the packages to their production
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7081d2e0cd1590126f391597afb350a6
https://doi.org/10.1109/impact.2016.7890814
https://doi.org/10.1109/impact.2016.7890814
Publikováno v:
Journal of Materials Engineering and Performance. 21:1611-1619
The design of blanking processes requires the availability of a procedure able to deal with both tooling and mechanical properties of the workpiece material (blank thickness, hardness, ductility, etc.). This research presents the development and comp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb0536057502cb0aa4435ca527572be6
https://doi.org/10.1007/s11665-011-0079-x
https://doi.org/10.1007/s11665-011-0079-x