Zobrazeno 1 - 10
of 61
pro vyhledávání: '"Elmar Platzgummer"'
Autor:
Mahesh Chandramouli, Bin Liu, Zachary Alberti, Frank E. Abboud, Gottfried Hochleitner, Witold Wroczewski, Stefan Kuhn, Christof Klein, Elmar Platzgummer
Publikováno v:
Photomask Technology 2022.
Autor:
Michael Haberler, Peter Hudek, Michal Jurkovic, Elmar Platzgummer, Christoph Spengler, Lena Bachar, Steffen Steinert, Hui-Wen Lu-Walther, Dirk Beyer
Publikováno v:
37th European Mask and Lithography Conference.
Publikováno v:
Photomask Technology 2022.
Autor:
Taigo Fujii, Amir Moqanaki, Christof Zillner, Harald Höller, Elmar Platzgummer, Masakazu Hamaji
Publikováno v:
Photomask Technology 2021.
The semiconductor industry's migration to EUV for the leading-edge nodes provides significant advantages and poses new challenges for the mask writers. The mask quality requirements for the leading-edge process technology call for ILT (Inverse Lithog
Publikováno v:
Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019.
Publisher’s Note: This video, originally published on 16 August 2019, was withdrawn per author request.
Autor:
Rao Nageswara, Peter Buck, Jed H. Rankin, Christoph Spengler, Peter Hudek, Murali Reddy, Stefan Eder-Kapl, Michal Jurkovic, Christian Bürgel, Bhardwaj Durvasula, Elmar Platzgummer, Jan Klikovits, Ingo Bork
Publikováno v:
Photomask Technology 2018.
Mask Process Correction (MPC) is well established as a necessary step in mask data preparation (MDP) for electron beam mask manufacturing at advanced technology nodes from 14nm and beyond. MPC typically uses an electron scatter model to represent e-b
Publikováno v:
Photomask Technology 2018.
This conference presentation, originally published on 10 October 2018, was withdrawn per author request.
Autor:
Elmar Platzgummer
Publikováno v:
2017 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA).
So far, electron beam technology has found SC industrial applications mainly for e-beam inspection and for VSB (variable shaped beam) mask writers. When using a single electron beam, with VSB there are throughput limitations making it impossible to f
Autor:
Christof Klein, Elmar Platzgummer
Publikováno v:
SPIE Proceedings.
The world’s first high throughput multi-beam mask writers (MBMW) have been realized by upgrading the existing MBMW Alpha and Beta tools with a 10x faster data path. In these tools a multi-beam column provides 262-thousand programmable beams of 20nm
Sputter-redeposition method for the fabrication of automatically sealed micro/nanochannel using FIBs
Autor:
Gerhard Hobler, Hans Loeschner, Elmar Platzgummer, Emmerich Bertagnolli, Andreas Steiger, Heung-Bae Kim, Alois Lugstein
Publikováno v:
International Journal of Precision Engineering and Manufacturing. 12:893-898
In this article, we report a new method for micro/nano fluidic channel fabrication by focused ion beams (FIB) utilizing the redeposition flux, or what we will refer to in this paper as SRM (sputter-redeposition method). Sputtered particles are byprod