Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Ellen Auerswald"'
Autor:
Armin Hindel, Battist Rabay, Ellen Auerswald, Adrian Stelzer, Dan R. Wargulski, Dirk Busse, Mohamad Abo Ras, Jacek Rudzki, Markus Bast
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In this work we show the capabilities of non-destructive testing by pulsed infrared thermography (PIRT) on large-area silver-sinter layers. This method can achieve a similar reliability in detecting delamination as SAM and X-ray analysis. The great a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd5b970a2a0c2807984a5e1d9cd4e0d2
https://doi.org/10.23919/empc44848.2019.8951861
https://doi.org/10.23919/empc44848.2019.8951861
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Progressive miniaturization and functional integration in the field of BEoL structures of modern CMOS components call for the use of new materials (porous or nanoparticles filled) in connection with completely new manufacturing technologies. Residual
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18819753215a8f994126bb25a2f8bc95
https://doi.org/10.1109/eurosime.2019.8724589
https://doi.org/10.1109/eurosime.2019.8724589
Silicon based pressure sensors often take advantage of piezo-resistive gages which are normally embedded by multiple silicon oxide and silicon nitride layers where gold lines form a Wheatstone bridge (Meti et al., 2016; Bae et al., 2004 [ 2 ]). Becau
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5eeb1b89dba8b29a89614ee39eeaeb9f
https://publica.fraunhofer.de/handle/publica/255802
https://publica.fraunhofer.de/handle/publica/255802
Publikováno v:
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Silicon based pressure sensors often take advantage of piezo-resistive gages which are normally embedded by multiple silicon oxide and silicon nitride layers where gold lines form a Wheatstone bridge. As a result of manufacturing - stepwise depositio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::778f44aabc98217e2d114c489297fd80
https://doi.org/10.1109/eurosime.2017.7926235
https://doi.org/10.1109/eurosime.2017.7926235
Autor:
Parisa Bayat, Dietrich R. T. Zahn, Raul D. Rodriguez, Sven Rzepka, J. Auersperg, Ellen Auerswald, Dietmar Vogel, Bernd Michel
Publikováno v:
Microelectronics Reliability. 54:1963-1968
Knowledge and control of local stress development in Back-End-of-Line (BEoL) stacks and nearby Through Silicon Vias (TSVs) in advanced 3D integrated devices is a key to their thermo-mechanical reliability. The paper presents a combined simulation/mea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b04610193883b90f3dd426acbf6e3a51
https://doi.org/10.1016/j.microrel.2014.07.098
https://doi.org/10.1016/j.microrel.2014.07.098
Autor:
John Brueckner, Dietmar Vogel, Rainer Dudek, Bernd Michel, Alfons Dehe, Ellen Auerswald, Sven Rzepka
The fracture strength of poly-silicon as widely used membrane material in micro electro mechanical system applications has a critical impact in respect to design, function and reliability of e.g. pressure sensors or microphones. This circumstance nec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::64a0dddde5744e174a8d02158ecf9ba7
https://publica.fraunhofer.de/handle/publica/240649
https://publica.fraunhofer.de/handle/publica/240649
A new measurement method for mechanical stresses with microscopic and sub-microscopic spatial resolution is presented. It bases on classical stress relief techniques in experimental mechanics, as for example the familiar hole drilling method. Applica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0a4a5528104ce96b3c40ab44324edd22
https://publica.fraunhofer.de/handle/publica/246401
https://publica.fraunhofer.de/handle/publica/246401
Publikováno v:
2015 China Semiconductor Technology International Conference.
Knowledge and control of local stress development in BEoL stacks and nearby TSVs in advanced 3D integrated devices is a key to their thermo-mechanical reliability. The paper presents a combined simulation / measurement approach to evaluate stresses g
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6dcb88673a8315e4e9c4ae58f43afa8
https://doi.org/10.1109/cstic.2015.7153465
https://doi.org/10.1109/cstic.2015.7153465
Autor:
Neus Sabaté, Bernd Michel, Ellen Auerswald, J. Keller, Astrid Gollhardt, J. Auersperg, Dietmar Vogel
Publikováno v:
Materials Science Forum. :121-126
New challenges for design, manufacturing and packaging of MEMS/NEMS arise from the ongoing miniaturization process. Therefore there is a demand on detailed information on thermo-mechanical material properties of the applied materials. Because of size
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3cc153c321412c360b1dc7493885d31
https://doi.org/10.4028/www.scientific.net/msf.524-525.121
https://doi.org/10.4028/www.scientific.net/msf.524-525.121
Autor:
Ellen Auerswald, John Brueckner, Bernhard Wunderle, Alfons Dehe, Rainer Dudek, S. Rzepka, Bernd Michel
Publikováno v:
2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).
The strength of poly-silicon membranes was investigated by experimental tests and numerical simulations. A new fracture test has been developed that replicates the loading situation under real service conditions well but with higher stress level. A s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8da6f4696a1f81ac48bc549ae3a0a82
https://doi.org/10.1109/dtip.2014.7056632
https://doi.org/10.1109/dtip.2014.7056632