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Autor:
Moreira WC; a School of Applied Sciences/FCA, Research Group in Manufacturing of Advanced Materials (CPMMA), University of Campinas (UNICAMP) , Limeira , Sao Paulo , Brazil., Elias ALP; a School of Applied Sciences/FCA, Research Group in Manufacturing of Advanced Materials (CPMMA), University of Campinas (UNICAMP) , Limeira , Sao Paulo , Brazil., Osório WR; a School of Applied Sciences/FCA, Research Group in Manufacturing of Advanced Materials (CPMMA), University of Campinas (UNICAMP) , Limeira , Sao Paulo , Brazil.; b School of Technology, University of Campinas , Limeira , Sao Paulo , Brazil., Padilha GS; a School of Applied Sciences/FCA, Research Group in Manufacturing of Advanced Materials (CPMMA), University of Campinas (UNICAMP) , Limeira , Sao Paulo , Brazil.
Publikováno v:
Journal of microencapsulation [J Microencapsul] 2019 Jun; Vol. 36 (4), pp. 327-337. Date of Electronic Publication: 2019 Jun 24.