Zobrazeno 1 - 5
of 5
pro vyhledávání: '"El Belghiti Alaoui, Nabil"'
Publikováno v:
In Microelectronics Reliability September 2018 88-90:288-293
Autor:
El Belghiti Alaoui, Nabil
Publikováno v:
Micro et nanotechnologies/Microélectronique. Institut National des Sciences Appliquées de Toulouse, 2020. Français
National audience; In production test strategies are currently based on optical inspection (AOI), X-ray inspection (AXI), electrical (ICT) and functional (FT) tests.Due to the multiplication and miniaturization of electrical components, the coexisten
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2592::4e82b874e82b6bec16f1d90f9d670030
https://hal.laas.fr/tel-03162010/document
https://hal.laas.fr/tel-03162010/document
Autor:
El Belghiti Alaoui, Nabil
Publikováno v:
Micro et nanotechnologies/Microélectronique. Institut National des Sciences Appliquées de Toulouse, 2020. Français
Micro et nanotechnologies/Microélectronique. INSA de Toulouse, 2020. Français. ⟨NNT : 2020ISAT0018⟩
Micro et nanotechnologies/Microélectronique. INSA de Toulouse, 2020. Français. ⟨NNT : 2020ISAT0018⟩
Until today, the production tests are based mainly on optical verification (AOI), X-ray inspection (AXI), electrical (ICT) and functional tests. Faced with the miniaturization of component packages, the high densification and integration of several t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::1f01a5c765e10469dbf5aa187b88ce2c
https://hal.laas.fr/tel-03162010/document
https://hal.laas.fr/tel-03162010/document
Publikováno v:
Microelectronics Reliability
29 th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2018)
29 th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2018), Oct 2018, Aalborg, Denmark. ⟨10.1016/j.microrel.2018.07.090⟩
29 th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2018)
29 th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2018), Oct 2018, Aalborg, Denmark. ⟨10.1016/j.microrel.2018.07.090⟩
International audience; With the density increase of today's printed circuit board assemblies (PCBA), the electronic fault detection methods reached their limits, in the same time the requirements of high reliability and robustness are greater. Indus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::3320e7d20228cfe7ff4ae3cabd169216
https://hal.laas.fr/hal-02319457
https://hal.laas.fr/hal-02319457
Publikováno v:
Journal of Electronic Testing; Dec2018, Vol. 34 Issue 6, p749-762, 14p