Zobrazeno 1 - 10
of 144
pro vyhledávání: '"Ek, U"'
Publikováno v:
Neuropsychiatric Disease and Treatment, Vol 2013, Iss default, Pp 163-168 (2013)
Ulla Ek,1 Joakim Westerlund,2 Elisabeth Fernell31Department of Special Education, 2Department of Psychology, Stockholm University, Stockholm, 3Gillberg Neuropsychiatry Centre, Sahlgrenska Academy, University of Gothenburg and the Research and Develop
Externí odkaz:
https://doaj.org/article/808f80f3716a4b03b02520041fd096ff
Publikováno v:
Neuropsychiatric Disease and Treatment, Vol 2012, Iss default, Pp 221-227 (2012)
Ulla Ek1, Fritjof Norrelgen3,4, Joakim Westerlund2, Andrea Dahlman5, Elizabeth Hultby5, Elisabeth Fernell61Department of Special Education, 2Department of Psychology, Stockholm University, Stockholm, Sweden; 3Department of Speech and Language Patholo
Externí odkaz:
https://doaj.org/article/96d44b6c2eb7405cbfa227a6c82f754a
Autor:
Dasović, B, Klanšek, U
Publikováno v:
IOP Conference Series: Materials Science & Engineering; 11/17/2021, Vol. 1209 Issue 1, p1-6, 6p
Autor:
Pearkao, Chatkane, Tangpaisarn, Thanat, Saensom, Donwiwat, Ek-u, Jeerawan, Suebkinorn, Orathai
Publikováno v:
Journal of the Medical Association of Thailand; 2021 Supplement, Vol. 104, pS44-S48, 5p
Autor:
Imatani, Shoji, Thammakornbunjut, Ek-u
Publikováno v:
Materials at High Temperatures. Nov2012, Vol. 29 Issue 4, p330-339. 10p. 4 Diagrams, 2 Charts, 6 Graphs.
Autor:
Ek, U1 (AUTHOR)
Publikováno v:
Child: Care, Health & Development. Sep2000, Vol. 26 Issue 5, p415-428. 13p.
Autor:
Ek-u Thammakornbunjut, Shoji Imatani
Publikováno v:
Materials at High Temperatures. 29:330-339
In order to clarify the mechanical state at the interface between substrate and coating material, numerical analyses are implemented on model materials under thermal loads, and the possibilities of...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74a357c04eb71995bf8f929657136d46
https://doi.org/10.3184/096034012x13486528828884
https://doi.org/10.3184/096034012x13486528828884
Autor:
Ek-u Thammakornbunjut, Shoji Imatani
Publikováno v:
International Journal of Engineering Science. 49:1443-1451
Deformation modes in thin films are discussed in order to evaluate the possible debonding mechanism. A combined simulation technique is employed in order to evaluate the thermo-mechanical response of a thin film layer attached to a substrate. A therm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eed49a10359281d22da52c9aba274190
https://doi.org/10.1016/j.ijengsci.2011.04.004
https://doi.org/10.1016/j.ijengsci.2011.04.004
Autor:
Thammakornbunjut, Ek-u
Kyoto University (京都大学)
0048
甲第16423号
エネ博第245号
新制||エネ||52(附属図書館)
29054
0048
甲第16423号
エネ博第245号
新制||エネ||52(附属図書館)
29054
Externí odkaz:
http://hdl.handle.net/2433/151903
