Zobrazeno 1 - 10 of 34 pro vyhledávání: '"Eiji Mochizuki"'
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Influence of Cooling Rates on Reliability of Solder Joints Using Sn–13wt.% Sb Binary Alloy for Power Semiconductor Modules
Autor: Yoshikazu Takahashi, Akira Morozumi, Yoshitaka Nishimura, Eiji Mochizuki, Hiroaki Hokazono
Publikováno v: IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:1139-1147
Power semiconductor devices for electric power conversion are operated at high temperatures and must exhibit high reliability. Therefore, high heat resistance and long fatigue lifetimes are necessary for the solder joints in these devices. In this pa
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::79c174817eb4659396d9b61172acb1a2
https://doi.org/10.1109/tcpmt.2016.2582599
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8
Higher thermal cycling reliability of power semiconductor module for power converters
Autor: Hiroaki Hokazono, Akira Morozumi, Yoshitaka Nishimura, Yoshikazu Takahashi, Eiji Mochizuki, Yoshiharu Kariya
Publikováno v: 2016 International Conference on Electronics Packaging (ICEP).
Power semiconductor devices for electric power conversion must be highly efficient, compact, and with large capacity. Therefore, highly thermo stability and long fatigue lifetime are necessary for the joint materials of these devices. In this paper,
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::f5156905029d870602d177f12959b844
https://doi.org/10.1109/icep.2016.7486857
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9
FULL-SCALE SHAKING TABLE TESTS OF TRADITIONAL WOODEN FRAME
Autor: Yasuhiko Inoue, Atsumichi Kushibe, Eiji Mochizuki, Toshihiro Kusunoki, Kurihara Takaaki, Hideo Kyuke
Publikováno v: AIJ Journal of Technology and Design. 18:153-158
In order to evaluate the dynamic characteristics (natural period, equivalent viscous damping ratio, etc.) of traditional wooden frames, full-scale shaking table tests were performed. In these tests, the following types of specimens were included; 1)
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::f4f51c7b8429a40eef218433efa7b55d
https://doi.org/10.3130/aijt.18.153
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10
Development of a New-Generation RoHS IGBT Module Structure for Power Management
Autor: Tatsuo Nishizawa, Eiji Mochizuki, Tomoaki Goto, Yoshikazu Takahashi, Shinobu Hashimoto, Yoshitaka Nishimura
Publikováno v: Transactions of The Japan Institute of Electronics Packaging. 1:40-47
This paper describes the design considerations for a high electric power density IGBT module structure mounted with smaller, new-generation chips. We have investigated heat flow depending on the copper foil thickness of an alumina based direct-copper
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5a4d6c00dd0627536ac828c82ed0d989
https://doi.org/10.5104/jiepeng.1.40
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