Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Eiji Iwamura"'
Publikováno v:
AIMS Materials Science, Vol 5, Iss 4, Pp 756-769 (2018)
Heat dissipation for electronic devices has attracted extensive interest because the reliability, lifetime, and performance are seriously affected by temperature increases during the operation. The effects of inorganic fillers in heat dissipation coa
Externí odkaz:
https://doaj.org/article/80c7b2f3f98e430c826157cec94899e4
Autor:
Eiji Iwamura
Publikováno v:
Materia Japan. 54:607-611
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1e542ee00373f136af846b06e89f827
https://doi.org/10.2320/materia.54.607
https://doi.org/10.2320/materia.54.607
Publikováno v:
Surface and Coatings Technology. 203:794-798
Nano-lamination is a new way to make full use of multi-layered structure for coating instead of the mono-layered coating system. Different from the conventional nano-lamination approach, where two different kinds of material system are deposited in l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6668f9ebb92cfa7a5f14e6da7d38040b
https://doi.org/10.1016/j.surfcoat.2008.08.059
https://doi.org/10.1016/j.surfcoat.2008.08.059
Publikováno v:
Journal of Materials Science. 43:6159-6166
Electrical beam (EB) irradiation is used to chemically modify the amorphous carbon film, a-C:H, which is prepared by the DC magnetron sputtering. The starting a-C:H film has vague columnar structure with lower density intercolumns as predicted by Tho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e93a7cabfe33d4a74c57ed1afa1a9d83
https://doi.org/10.1007/s10853-008-2933-2
https://doi.org/10.1007/s10853-008-2933-2
Publikováno v:
Surface and Coatings Technology. 202:1177-1181
In parallel with down-sizing of electrical devices and products, manufacturing is forced to be also miniatured to fabricate small-sized electrical parts with the geometric size in millimeters. This type of micro-stamping, suffers from two issues: sta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74014b451b12079c010c9385fddd177f
https://doi.org/10.1016/j.surfcoat.2007.05.059
https://doi.org/10.1016/j.surfcoat.2007.05.059
Autor:
Eiji IWAMURA
Publikováno v:
Journal of The Surface Finishing Society of Japan. 58:260-266
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79ff74f13a93257879d513e86d984c42
https://doi.org/10.4139/sfj.58.260
https://doi.org/10.4139/sfj.58.260
Autor:
Eiji Iwamura
Publikováno v:
Materia Japan. 41:635-643
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc5ef4ec0e538218d0ac87f152fd6e7a
https://doi.org/10.2320/materia.41.635
https://doi.org/10.2320/materia.41.635
Publikováno v:
Thin Solid Films. 349:191-198
The effect of surface oxide layers on thermally induced hillock formation was examined in AlTa and AlCu alloy films. An anodic oxide or a sputter-deposited oxide layer was intentionally formed on the top of the Al alloy films, and subsequently anneal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9248fd18c5da4aa1a044030e1cee1dfc
https://doi.org/10.1016/s0040-6090(99)00220-5
https://doi.org/10.1016/s0040-6090(99)00220-5
Publikováno v:
Thin Solid Films. 340:306-316
Morphology of Al–2.0at%Ta and Al–2.0 at.% Nd alloy films before and after annealing was investigated for applications of interconnections for liquid crystal displays. It was found that the morphology and the microstructure of Al–2.0 at.% Nd all
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::17605b5430ac45361cf09c61c1d836ab
https://doi.org/10.1016/s0040-6090(98)01466-7
https://doi.org/10.1016/s0040-6090(98)01466-7
Publikováno v:
Journal of the Surface Finishing Society of Japan. 50:52-57
The temperature dependence of metal nitride thermal stress was measured up to 500°C using a high-temperature thin film stress system (Tencor F2400), and primary results for TiN, CrN, Cr2N, and AlTiN were presented. A series of metal nitrides-TiN, Cr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::904d1072214593cd60f70bc2bc4d6548
https://doi.org/10.4139/sfj.50.52
https://doi.org/10.4139/sfj.50.52