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pro vyhledávání: '"Eigenraam, A.B.C."'
Autor:
Sadeghian Marnani, H., Dekker, A., Herfst, R.W., Winters, J., Eigenraam, A.B.C., Rijnbeek, R.A., Nulkes, N.
Publikováno v:
Cain, J.P.Sanchez, M.I., SPIE Advanced Lithography conference on Metrology, Inspection, and Process Control for Microlithography XXIX, 22-26 February 2015, San Jose, California, USA, 9424
With the device dimensions moving towards the 1X node and below, the semiconductor industry is rapidly approaching the point where existing metrology, inspection and review tools face huge challenges in terms of resolution, the ability to resolve 3D
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http://resolver.tudelft.nl/uuid:33268b1f-f7ec-406f-8777-abcd068f703a
http://resolver.tudelft.nl/uuid:33268b1f-f7ec-406f-8777-abcd068f703a