Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Efrain Aguilera"'
Autor:
Callum Bailey, Efrain Aguilera, David Espalin, Jose Motta, Alfonso Fernandez, Mireya A. Perez, Christopher Dibiasio, Dariusz Pryputniewicz, Eric Macdonald, Ryan B. Wicker
Publikováno v:
IEEE Access, Vol 6, Pp 1985-1994 (2018)
The ability to access individual layers of a part as they are being printed has allowed additive manufacturing (AM) researchers to experiment with the in situ placement of components, thereby creating multi-process parts with additional functionality
Externí odkaz:
https://doaj.org/article/9d5bb1ad58df4c1e8de93538c74dd3e8
Autor:
Eric Macdonald, Rudy Salas, David Espalin, Mireya Perez, Efrain Aguilera, Dan Muse, Ryan B. Wicker
Publikováno v:
IEEE Access, Vol 2, Pp 234-242 (2014)
In new product development, time to market (TTM) is critical for the success and profitability of next generation products. When these products include sophisticated electronics encased in 3D packaging with complex geometries and intricate detail, TT
Externí odkaz:
https://doaj.org/article/7f3f624ae53449b8a1fcd0b9a7294356
Autor:
Ryan B. Wicker, David Espalin, Eric MacDonald, Alfonso Fernandez, Mireya A. Perez, Efrain Aguilera, Jose Motta, Dariusz R. Pryputniewicz, Christopher Dibiasio, Callum Bailey
Publikováno v:
IEEE Access, Vol 6, Pp 1985-1994 (2018)
The ability to access individual layers of a part as they are being printed has allowed additive manufacturing (AM) researchers to experiment with the in situ placement of components, thereby creating multi-process parts with additional functionality
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c66c25bc12bd6d2dfe85e0ed39c16307
https://doi.org/10.1109/access.2017.2781249
https://doi.org/10.1109/access.2017.2781249
Autor:
Efrain Aguilera, Ryan B. Wicker, Fernando Cedillos, David Espalin, Jorge Ramos, E. Maestas, Danny W. Muse, Corey Shemelya, Eric MacDonald
Publikováno v:
2013 IEEE SENSORS.
Recent advances in the field of 3D printing have utilized embedded electronic interconnects in order to construct advanced electronic devices. This work builds on these advances in order to construct and characterize arbitrarily formed capacitive sen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::861f64dcd759fdca6f75b7096377e7c5
https://doi.org/10.1109/icsens.2013.6688247
https://doi.org/10.1109/icsens.2013.6688247