Zobrazeno 1 - 10
of 126
pro vyhledávání: '"Ee Hua Wong"'
Publikováno v:
Metals, Vol 6, Iss 9, p 219 (2016)
Background—The creep-fatigue properties of stainless steel 316 are of interest because of the wide use of this material in demanding service environments, such as the nuclear industry. Need—A number of models exist to describe creep-fatigue behav
Externí odkaz:
https://doaj.org/article/90aecb53ac2a4f389e3f330c35f74a5c
Autor:
Ee-Hua Wong1,2 ehwong@ntu.edu.sg, Johan Liu3,4 johan.liu@chalmers.se
Publikováno v:
Polymers (20734360). Dec2017, Vol. 9 Issue 12, p664. 13p. 2 Diagrams, 1 Chart, 1 Graph.
Autor:
Ee Hua Wong, Johan Liu
Publikováno v:
Microelectronics Reliability. 79:206-220
The closed-form solutions for the interfacial stresses in assemblies constituting of two relatively stiff adherends sandwiching a relatively compliant adhesive layer are reviewed. The closed-form solutions are categorised into the “non-free edge so
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68894ff070d9c51045abecd97cc470c0
https://doi.org/10.1016/j.microrel.2017.03.010
https://doi.org/10.1016/j.microrel.2017.03.010
Autor:
Ee Hua Wong
Publikováno v:
International Journal of Adhesion and Adhesives. 78:4-12
Assuming negligible in-plane stress, non-varying shear stress, and linearly varying transverse stress along the thickness of the adhesive, the closed-form solutions for the interfacial shear and the interfacial peeling stresses in balanced bonded san
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::372cd9d4c996d7504cc04f097f618fc3
https://doi.org/10.1016/j.ijadhadh.2017.06.003
https://doi.org/10.1016/j.ijadhadh.2017.06.003
Publikováno v:
International Journal of Fatigue. 98:167-175
Background The existing creep-fatigue models are valid over limited ranges of temperatures and frequencies. Need There is a need to develop a creep-fatigue equation that covers the full range of phenomena from pure fatigue to pure creep rupture, and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df9615176384db50f6060985161f6311
https://doi.org/10.1016/j.ijfatigue.2016.11.030
https://doi.org/10.1016/j.ijfatigue.2016.11.030
Publikováno v:
Microelectronics Reliability. 67:135-142
The stress-strain data of four solder alloys - Sn37Pb, Sn1·0Ag0.1Cu, Sn3·5Ag, and Sn3·0Ag0.5Cu – at seven initial strain rates between 0.005 s− 1 to 300 s− 1 have been generated using a combination of mechanical and drop-weight compression t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22d00520a2ddc7265619e51419b29d13
https://doi.org/10.1016/j.microrel.2016.10.007
https://doi.org/10.1016/j.microrel.2016.10.007
Autor:
Ee Hua Wong, Seungbae Park
Publikováno v:
Microelectronics Reliability. 65:318-326
Techniques for enforcing the continuity of solute field in heterogeneous solvent under the conditions of steady temperature-humidity, steady temperature but dynamic humidity, and dynamic temperature are reviewed. The continuity of the wetness techniq
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2653bb40135c81ef46c9f4869472c11
https://doi.org/10.1016/j.microrel.2016.08.009
https://doi.org/10.1016/j.microrel.2016.08.009
Publikováno v:
International Journal of Solids and Structures. 96:136-144
We have investigated the possible oscillation of linear and non-aging viscoelastic functions of viscoelastic models whose governing differential equations representing the constitutive relation between stresses and strains are of second order. We hav
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7294472203ae06ba8a7b2f38ccc1f8e3
https://doi.org/10.1016/j.ijsolstr.2016.06.015
https://doi.org/10.1016/j.ijsolstr.2016.06.015
Publikováno v:
Microelectronics Reliability. 59:1-12
The goal of creep fatigue modelling is the compounding of the damage caused by creep and fatigue mechanisms. The different approaches for compounding these damage mechanisms have led to several different creep fatigue models: (i) ignore fatigue damag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77d6d131bb404e4b63cf1e47798bd118
https://doi.org/10.1016/j.microrel.2016.01.013
https://doi.org/10.1016/j.microrel.2016.01.013
Autor:
Ee Hua Wong
Publikováno v:
International Journal of Adhesion and Adhesives. 65:19-27
Compared to the theory of elasticity solutions the strength of material solutions offer closed form solutions that is favoured by practising engineers for performing design analysis. However, the existing strength of material solutions for a sandwich
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0c00e82c7bc89dc7366dd95a09acd6d
https://doi.org/10.1016/j.ijadhadh.2015.10.021
https://doi.org/10.1016/j.ijadhadh.2015.10.021