Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Edward S. Hermann"'
Autor:
Edward S. Hermann, John Carulli, Carmelo F. Scrudato, Steven B. Herschbein, Kyle M. Winter, Brian Yates
Publikováno v:
International Symposium for Testing and Failure Analysis.
Focused Ion Beam (FIB) chip circuit editing is a well-established highly specialized laboratory technique for making direct changes to the functionality of integrated circuits. A precisely tuned and placed ion beam in conjunction with process gases s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4393088a11014e675c6da4e7ad89a1bf
https://doi.org/10.31399/asm.cp.istfa2020p0122
https://doi.org/10.31399/asm.cp.istfa2020p0122
Publikováno v:
International Symposium for Testing and Failure Analysis.
The Focused Ion Beam (FIB) technique of internal modification for chip repair, layout verification, and internal signal probe access has become an integral part of the process for bringing advanced products to market. The pervasive switch from wire b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bcbb9cc4d979b01f586b42574fe8ff3c
https://doi.org/10.31399/asm.cp.istfa2013p0123
https://doi.org/10.31399/asm.cp.istfa2013p0123
Publikováno v:
International Symposium for Testing and Failure Analysis.
For most advanced semiconductor products, Focused Ion Beam (FIB) circuit modification and node access through the backside of the chip is the only viable approach. The high density of interconnect wiring and the presence of C4 solder bumping for chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15c373d29038e25a111bfcac565d126a
https://doi.org/10.31399/asm.cp.istfa2011p0031
https://doi.org/10.31399/asm.cp.istfa2011p0031
Publikováno v:
International Symposium for Testing and Failure Analysis.
Focused Ion Beam (FIB) success has become more difficult as microchip process technology advances, requiring new techniques for damage control both during the microsurgery procedure and before the finished product can be electrically tested. Ultra th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::29f9ee7b678fbbb0455333f38456141c
https://doi.org/10.31399/asm.cp.istfa2004p0166
https://doi.org/10.31399/asm.cp.istfa2004p0166