Zobrazeno 1 - 10
of 69
pro vyhledávání: '"Edward I. Cole"'
Publikováno v:
International Symposium for Testing and Failure Analysis.
This presentation covers the basic physics needed to understand and to effectively apply backside IC analysis techniques to flip-chip packaged die. It describes the principles of light transmission through silicon and the factors that influence optic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::41939e47f7584e77225b53170f709364
https://doi.org/10.31399/asm.cp.istfa2022tpg1
https://doi.org/10.31399/asm.cp.istfa2022tpg1
Publikováno v:
International Symposium for Testing and Failure Analysis.
This presentation covers the basic physics needed to effectively apply backside IC analysis techniques to flip-chip packaged die. It describes the principles of light transmission through silicon and the factors that influence optical image formation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e823c5dbdf48d5e84d40496e13cf45bc
https://doi.org/10.31399/asm.cp.istfa2021tpg1
https://doi.org/10.31399/asm.cp.istfa2021tpg1
Autor:
Michael A. Melia, George Buffleben, Jason M. Taylor, Natalia Jouravel, Ahadi-Yusuf Martin, Neil Sorensen, Oscar A. Negrete, Wahid Hermina, Anne Grillet, Grant Rossman, Anthony James, Kent S. Smith, Jesse Cahill, Mark Tucker, Brad H. Jones, Todd Barnett, Maxwell Stefan, Edward I. Cole, Anupama Sinha, Philip R. Miller, Isaac Avina, William Corbin, Bradley A. Steinfeldt, Matt Tezak, George D. Bachand, Patrick D. Burton, Sara Dickens, James Ricken, Jeffrey P. Koplow, Mark R. Ackermann, Brooke Harmon, Lauren Atencio, Andres Martinez-Sanchez, Richard A. Karnesky
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aea490d96d4c22637ec4f8c3e9ce2345
https://doi.org/10.2172/1681092
https://doi.org/10.2172/1681092
Publikováno v:
IRPS
The defect detection capabilities of Power Spectrum Analysis (PSA) [1] have been successfully combined with local laser heating to isolate defective circuitry in a high-speed Si Phase Locked Loop (PLL). The defective operation resulted in missed coun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc6cd0b33fbfdfaea24273d66ccaa402
https://doi.org/10.1109/irps45951.2020.9129560
https://doi.org/10.1109/irps45951.2020.9129560
Autor:
Paiboon Tangyunyong, Joshua Beutler, Biliana S. Paskaleva, Edward I. Cole, Guillermo M. Loubriel, Thomas E. Buchheit, Darlene M. Udoni
Publikováno v:
International Symposium for Testing and Failure Analysis.
We present a new, non-destructive electrical technique, Power Spectrum Analysis (PSA). PSA as described here uses off-normal biasing, an unconventional way of powering microelectronics devices. PSA with off-normal biasing can be used to detect subtle
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3118ac4af82cdad6b8042afae7cb34af
https://doi.org/10.31399/asm.cp.istfa2017p0073
https://doi.org/10.31399/asm.cp.istfa2017p0073
Autor:
Gregory N. Nielson, Paul J. Resnick, Jose Luis Cruz-Campa, Murat Okandan, Benjamin B. Yang, Paiboon Tangyunyong, Edward I. Cole, Alice C. Kilgo, Gaddi Haase
Publikováno v:
IEEE Journal of Photovoltaics. 4:470-476
Microsystems-enabled photovoltaics (MEPV) has great potential to meet the increasing demands for light-weight, photovoltaic solutions with high power density and efficiency. This paper describes effective failure analysis techniques to localize and c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22bacdf081c0ba9bdb9e8ff0b9b34fd6
https://doi.org/10.1109/jphotov.2013.2284864
https://doi.org/10.1109/jphotov.2013.2284864
Publikováno v:
HOST
The microelectronics industry seeks screening tools that can be used to verify the origin of and track integrated circuits (ICs) throughout their lifecycle. Embedded circuits that measure process variation of an IC are well known. This paper adds to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82179d95ef951c33986a6f19c9252e65
https://doi.org/10.1109/hst.2016.7495572
https://doi.org/10.1109/hst.2016.7495572
Understanding the Effects of Local Structures on TIVA Profiles Using Thermal Modeling and Simulation
Autor:
Paiboon Tangyunyong, Edward I. Cole
Publikováno v:
EDFA Technical Articles. 12:10-18
Thermally-induced voltage alteration (TIVA) is a laser-based method for localizing interconnect defects in ICs. Its main limitation is that the laser must heat the defect and change its resistance sufficiently to produce a measurable voltage alterati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01d1e77887fd7a618bf984153af5e323
https://doi.org/10.31399/asm.edfa.2010-3.p010
https://doi.org/10.31399/asm.edfa.2010-3.p010
Autor:
Edward I. Cole
Publikováno v:
EDFA Technical Articles. 12:4-8
One of the pioneering developers of induced voltage alteration (IVA) measurement techniques assesses the current state of the technology, the impact of major advancements, and the potential for further improvements. The assessment pays particular att
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9657bc45a85bc68ea3ffc8cd19039e79
https://doi.org/10.31399/asm.edfa.2010-3.p004
https://doi.org/10.31399/asm.edfa.2010-3.p004