Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Edith Steinhäuser"'
Autor:
Tobias Bernhard, Stefan Kempa, Sebastian Zarwell, Edith Steinhäuser, R. Massey, Frank Branduuml
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:40-50
The effect of the Cu target pad roughness on the growth mode of electroless Cu from two different Cu baths was investigated, with bath A having a cyanide based, and bath B, a non-cyanide-based stabilizer system. Both baths are commonly used within th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57d9b3a82a8579f2b8592e5052d0ea3b
https://doi.org/10.4071/imaps.1409209
https://doi.org/10.4071/imaps.1409209
Autor:
S. Branagan, Edith Steinhäuser, Lutz Stamp, Laurence J. Gregoriades, Tobias Bernhard, Frank Brüning, R. Schulz
Publikováno v:
International Symposium on Microelectronics. 2019:000492-000502
A key factor for a high electrical reliability of multilayer High Density Interconnection Printed Circuit Boards (HDI PCBs) is the thermomechanical stability of stacked microvia interconnections. With decreasing via sizes and higher numbers of interc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f754a41cb38d99fa07ccadcefb6c4d2d
https://doi.org/10.4071/2380-4505-2019.1.000492
https://doi.org/10.4071/2380-4505-2019.1.000492
Publikováno v:
2020 International Wafer Level Packaging Conference (IWLPC).
Within the chemical reactions occurring during the deposition of electroless Copper, a low level of Hydrogen gas is evolved, and unless immediately removed, which can be problematic, is prone to accumulation on the freshly formed Cu surface. As furth
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b357517cb60b99038408ba2dda1e18f8
https://doi.org/10.23919/iwlpc52010.2020.9375896
https://doi.org/10.23919/iwlpc52010.2020.9375896
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Hydrogen is inevitably produced during electroless Cu plating, it accumulates on the Cu-surface, forms gas bubbles and sticks on the as-growing Cu surface. The encapsulation of these gas-bubbles in the electroless Cu layer results in nanoporous, low
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3bf32e8c07b53301fb456d99a061b17d
https://doi.org/10.1109/ectc32862.2020.00121
https://doi.org/10.1109/ectc32862.2020.00121
Autor:
Sandra Röseler, Christian Wendeln, Sebastian Reiber, Sebastian Dünnebeil, Edith Steinhäuser, Bexy Dosse-Gomez, Elisa Langhammer, Lutz Stamp
Publikováno v:
International Symposium on Microelectronics. 2018:000628-000633
This work describes a new type of formaldehyde-free electroless copper electrolyte that can be used for a broad set of applications and materials, especially for the processing of next-generation substrates. The plating solution was successfully appl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d5a9eba4a88ceff35040e035140c795
https://doi.org/10.4071/2380-4505-2018.1.000628
https://doi.org/10.4071/2380-4505-2018.1.000628
Autor:
E. R. Logan, Ning Chen, Tanu Sharma, Ralf Brüning, Edith Steinhäuser, Tobias Bernhard, Sebastian Zarwell, Frank Brüning
Publikováno v:
Thin Solid Films. 626:131-139
Plating rates and Ni co-deposition were measured for electroless Cu plating baths without and with an added proprietary stabilizer system. The bath has formaldehyde as reducing agent and tartrate as complexing agent. The concentrations of Ni and stab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ab13c39a4abdec5772b6137370758eb
https://doi.org/10.1016/j.tsf.2017.02.026
https://doi.org/10.1016/j.tsf.2017.02.026
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
The electrical reliability of multilayer High Density Interconnection Printed Circuit boards (HDI PCBs) is mainly affected by the thermo-mechanical stability of stacked micro via interconnections. In this regard, a critical failure mode is the stress
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b5f5408644eb436759abd4a1386db2d7
https://doi.org/10.23919/iwlpc.2019.8914011
https://doi.org/10.23919/iwlpc.2019.8914011
Autor:
Edith Steinhäuser
Publikováno v:
Circuit World. 36:4-8
PurposeThe purpose of this paper is the investigation of the catalytic activities of selected metals in reductant oxidation.Design/methodology/approachElectrochemical measurements were carried out in order to obtain information about the catalytic ac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7dbc658fa88b5f517c6e823d931d7c38
https://doi.org/10.1108/03056121011066279
https://doi.org/10.1108/03056121011066279
Publikováno v:
Circuit World. 36:20-23
PurposeThe purpose of this paper is to examine the use of additives in formaldehyde‐free copper‐plating solutions with low reducing agent (RA) concentration to improve the start reaction of electroless copper deposition and to enable a copper‐p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78b92736e8d2ff1bc01c8cedeeba0abb
https://doi.org/10.1108/03056121011041663
https://doi.org/10.1108/03056121011041663
Autor:
T.A. Magaya, Edith Steinhäuser
Publikováno v:
International Symposium on Microelectronics. 2010:000861-000866
Electroless copper plating is the most important and critical step for through-hole metallization of printed circuit boards. Conventional electroless copper solutions contain formaldehyde as the standard reducing agent. Due to the toxic nature of for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54911b3b345d9a1efe7805174522b2bf
https://doi.org/10.4071/isom-2010-tha3-paper6
https://doi.org/10.4071/isom-2010-tha3-paper6