Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Eddy Blansaer"'
Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
This work concerns the impact of mounting the PCB onto the housing with respect to the reliability of the solder joints of components assembled to this board. Due to the thermal expansion mismatch between the housing and PCB, additional stress is app
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8705bd6f1233c0747489a9b6756d0a86
https://doi.org/10.1109/eurosime48426.2020.9152724
https://doi.org/10.1109/eurosime48426.2020.9152724
Autor:
Eddy Blansaer, Riet Labie, Ralph Lauwaert, Daniel Werkhoven, Davy Pissoort, Daniel Vanderstraeten, Jonas Lannoo, Bart Vandevelde
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In this work, the solder joint reliability of QFN components is experimentally tested in thermal cycling and four-point bending cycling conditions, and this for three different solder materials: standard SAC305, low Ag SAC alloy and a new low melting
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d9f25cb914bf1d18c0b37f308b38235
https://doi.org/10.1109/eurosime.2019.8724511
https://doi.org/10.1109/eurosime.2019.8724511
Autor:
A. Ivankovic, Eddy Blansaer, Kris Vanstreels, Renaud Gillon, Daniel Vanderstraeten, Bart Vandevelde, Guy Brizar
Publikováno v:
Microelectronics Reliability. 52:2677-2684
Knowing the Young’s modulus of a plastic molding compound and how it evolves over time and with temperature provides valuable information since it has an important impact on the thermo-mechanical stress that is imposed on a packaged IC. This paper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7df84cbea7a06461ddfc275b34e4d2b8
https://doi.org/10.1016/j.microrel.2012.06.024
https://doi.org/10.1016/j.microrel.2012.06.024
Autor:
Eddy Blansaer, A. Ivankovic, Yung-Yu Hsu, Martijn Defloor, Mireia Bargallo Gonzalez, Daniel Vanderstraeten, D. Degryse, K. Vandaele, Renaud Gillon, Kris Vanstreels, Bart Vandevelde, Guy Brizar
Publikováno v:
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
This paper reports the impact of ageing on the cohesive and adhesive strength of overmould materials used in electronic packages. For so-called harsh environment applications, the overmoulded package operates in an ambient at a continuous temperature
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc4c5789ba32c6160f2f59e1450f476d
https://doi.org/10.1109/esime.2011.5765846
https://doi.org/10.1109/esime.2011.5765846
Autor:
Eddy Blansaer, Bart Vandevelde, Andrej Ivankovic, Daniel Vanderstraeten, Guy Brizar, Renaud Gillon, Kris Vanstreels
Publikováno v:
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
This work presents two different methods that offer a faster, easier and more straightforward data analysis methods for Young's modulus extraction of plastic molding compound materials. Both methods are compared and verified with the nano-indentation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ea7fe23408953def0eec91028112552
https://doi.org/10.1109/esime.2010.5464535
https://doi.org/10.1109/esime.2010.5464535
Publikováno v:
2008 2nd Electronics Systemintegration Technology Conference.
In this work, flip chip is investigated as an alternative assembly technology for packaging applications requiring driving high electrical currents up to 10A and high IC power dissipation. Currently, automotive applications with components driving (t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bf75d399a2fd7888eaa8500c2e7cbae
https://doi.org/10.1109/estc.2008.4684415
https://doi.org/10.1109/estc.2008.4684415