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Autor:
Christopher N. Collins, Ed Sprogis, Mike Cranmer, Daniel Berger, Franklin M. Baez, Michael J. Shapiro, Jean Audet, Subramania S. Iyer
Publikováno v:
2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.
A multichip module package has been designed in IBM's silicon technology. The module consists of two chips of same size and type communicating horizontally through a silicon interposer to a large ASIC chip. The chip to chip links operate at 8 Gbps wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b359ad39a792e93b4132849f45a3e332
https://doi.org/10.1109/epeps.2012.6457902
https://doi.org/10.1109/epeps.2012.6457902
