Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Ed Graddy"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-18
Low Temperature Co-fired Ceramics (LTCC) represent a multilayer electronic packaging technology with the ability to incorporate many electrical components such as conductive, resistive, and dielectric materials, into a single monolithic package. Exam
Autor:
Jeff Holthus, Bradford Smith, George E. Sakoske, Ed Graddy, John J. Maloney, James D. Walker, Cody Gleason, Jim Henry, Sid Sridharan
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000136-000141
An LTCC tape dielectric (A6M) was fired stepwise from 775°C – 925°C using standard industry profiles. The fired tapes were investigated for shrinkage, density, crystallization (XRD), composition distribution (SEM/EDS), and high frequency (10 GHz)
Publikováno v:
Conveyor Belt Furnace Thermal Processing ISBN: 9783319697291
Metallization is a critical processing step in Silicon solar cell manufacturing. Typically, cells are metalized by a rapid thermal cycle in an IR belt furnace. For proper yield, it is critical to maintain the wafer thermal profile within tight tolera
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::198141d687470f04899396ed1a72069c
https://doi.org/10.1007/978-3-319-69730-7_8
https://doi.org/10.1007/978-3-319-69730-7_8
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
The electronic and physical properties of two LTCC dielectrics (Ferro L8 and A6M) were investigated as a function of peak firing temperature. One dielectric (L8) consists of a ceramic-filled glass composite while the other (A6M) consists of a crystal
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:000119-000126
Ferro glass and conductor core competencies have combined to develop a unique and superior electronic packaging system. Recent advances have resulted in a new mechanically robust packaging system for high frequency packaging applications. The new sys
Publikováno v:
Energy Procedia. 8:607-613
In silicon solar cells, forming good ohmic contact between the emitter and the metal with minimum contact resistance is critical to achieve peak electrical performance [1] . In commercial solar cells, screen printable silver paste is commonly used to
Publikováno v:
2011 37th IEEE Photovoltaic Specialists Conference.
Solar cell manufacturers across the world are working to find innovative ways to reduce cost per installed watt of photovoltaic energy generation in order to achieve grid parity. Some of these approaches involve the use of revolutionary cell architec
Publikováno v:
2011 37th IEEE Photovoltaic Specialists Conference.
The Photovoltaic market has grown tremendously during the past decade. HIT (Heterojuction with Intrinsic Thin layer) cells have drawn special attention because of their potential ability for further cost reduction to achieve grid parity. HIT cells ha
Publikováno v:
2011 37th IEEE Photovoltaic Specialists Conference.
This paper presents high performance Al pastes for n-type solar cells with p-type backside. These pastes were screen printed and subsequently fired in a belt furnace to form rear-Al emitters. Internal Quantum Efficiency (IQE), and full I-V curve char
Publikováno v:
2010 35th IEEE Photovoltaic Specialists Conference.
In this work, we present the development of a new series of screen printable metal contact pastes for p+ doped Si surfaces in solar cells. The p-surface contact metallization is needed for new devices based on n-type wafers and for bifacial cells. Th