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pro vyhledávání: '"Ebendorff-Heiperime, H."'
Publikováno v:
2009 International SoC Design Conference (ISOCC); 2009, p1-4, 4p
Publikováno v:
ResearcherID
Advances in System on Chip (SoC) and System in Package (SiP) that draw upon experiences gained from nano, bio and photon based technologies have created a new domain that permits fabrication of multiplicity of independent technologies as part of 3D h
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