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pro vyhledávání: '"Earnest C. Murphy"'
Publikováno v:
SPIE Proceedings.
The via-first process is unique by the fact that a material is needed to fill the vias to some arbitrary value, with little or no isolated-dense via bias so that the underlying layer underneath the via is protected from the trench etch step. Secondly
Publikováno v:
Advances in Resist Technology and Processing XVII.
Deep ultraviolet (DUV) bottom anti-reflective coating (BARC)- to-resist compatibility is a key component in process optimization. In addition to the reduction of optical interference effects, BARC's also improve CD uniformity by preventing substrate
Publikováno v:
SPIE Proceedings.
A fast-etching broad band bottom anti-reflective coating (BARC) for photoresist applications at the wavelength of 365nm, 248nm and 193nm was developed. The new BARC formulated in safe solvents such as ethyl lactate and PGME exhibits wide spin bowl co
Conference
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