Zobrazeno 1 - 10
of 1 816 877
pro vyhledávání: '"ELECTRONICS"'
Autor:
Tiwari S; Department of Physics, Indian Institute of Technology Bhilai, Bhilai, Chhattisgarh 491002, India., Ghosh T; Materials and Device Laboratory, Indian Institute of Technology Indore, Simrol, Indore 453552, India., Kandpal S; Materials and Device Laboratory, Indian Institute of Technology Indore, Simrol, Indore 453552, India., Saxena S; Department of Physics and Nanotechnology, College of Engineering and Technology, SRM Institute of Science and Technology, Chennai, 603203 Tamil Nadu, India., Kumar R; Materials and Device Laboratory, Indian Institute of Technology Indore, Simrol, Indore 453552, India.; Centre for Advanced Electronics, Indian Institute of Technology Indore, Simrol, Indore 453552, India., Prakash R; Department of Materials Science and Metallurgical Engineering, Indian Institute of Technology Bhilai, Bhilai, Chhattisgarh 491002, India., Chaudhary A; Department of Physics, Indian Institute of Technology Bhilai, Bhilai, Chhattisgarh 491002, India.
Publikováno v:
ACS applied bio materials [ACS Appl Bio Mater] 2024 Aug 19; Vol. 7 (8), pp. 5107-5120. Date of Electronic Publication: 2024 Jul 09.
Autor:
Gong M; School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, China., Wang X; School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, China., Wu Z; School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China., Yue L; School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, China., Chen Q; School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, China., Li H; School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, China., Lin X; School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, China., Zhang L; School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, China., Wang D; School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, China.
Publikováno v:
Small (Weinheim an der Bergstrasse, Germany) [Small] 2024 Jul; Vol. 20 (30), pp. e2400161. Date of Electronic Publication: 2024 Mar 03.
Autor:
Belleri P; Department of Information Engineering, University of Brescia, via Branze 38, 25123, Brescia, Italy., Pons I Tarrés J; Max Planck Institute for Polymer Research, Ackermannweg 10, 55128, Mainz, Germany., McCulloch I; Department of Chemistry, University of Oxford, 12 Mansfield Road, Oxford, UK., Blom PWM; Max Planck Institute for Polymer Research, Ackermannweg 10, 55128, Mainz, Germany., Kovács-Vajna ZM; Department of Information Engineering, University of Brescia, via Branze 38, 25123, Brescia, Italy., Gkoupidenis P; Max Planck Institute for Polymer Research, Ackermannweg 10, 55128, Mainz, Germany. gkoupidenis@mpip-mainz.mpg.de.; Department of Electrical and Computer Engineering, North Carolina State University, 890 Oval Dr, Raleigh, NC, USA. gkoupidenis@mpip-mainz.mpg.de.; Department of Physics, North Carolina State University, 2401 Stinson Dr, Raleigh, NC, USA. gkoupidenis@mpip-mainz.mpg.de., Torricelli F; Department of Information Engineering, University of Brescia, via Branze 38, 25123, Brescia, Italy. fabrizio.torricelli@unibs.it.
Publikováno v:
Nature communications [Nat Commun] 2024 Jun 24; Vol. 15 (1), pp. 5350. Date of Electronic Publication: 2024 Jun 24.
Protocol to develop a moisture-desorptive passive cooling system for electronics thermal management.
Autor:
Sui Z; School of Energy and Environment, City University of Hong Kong, Hong Kong 999077, China., Sui Y; School of Energy and Environment, City University of Hong Kong, Hong Kong 999077, China., Ding Z; School of Energy and Environment, City University of Hong Kong, Hong Kong 999077, China., Lin H; School of Energy and Environment, City University of Hong Kong, Hong Kong 999077, China., Li F; School of Energy and Environment, City University of Hong Kong, Hong Kong 999077, China., Wu W; School of Energy and Environment, City University of Hong Kong, Hong Kong 999077, China. Electronic address: weiwu53@cityu.edu.hk.
Publikováno v:
STAR protocols [STAR Protoc] 2024 Jun 21; Vol. 5 (2), pp. 103033. Date of Electronic Publication: 2024 Apr 22.
Autor:
Khan W; Department of Physics, Bacha Khan University, Charsada, Pakistan. Electronic address: walayat76@gmail.com., Kushwaha AK; Department of Physics, S.I.G. Govt. P.G. College, Lalganj, Mirzapur, U.P., India; Department of Physics, K.N. Govt. P.G. College, Gyanpur, Bhadohi, 221304, U.P., India., Al-Amer R; Department of Physics and Astronomy, College of Science, King Saud University, Riyadh, 11451, Kingdom of Saudi Arabia., Alanazi N; Department of Physics and Astronomy, College of Science, King Saud University, Riyadh, 11451, Kingdom of Saudi Arabia., Alqahtani HR; Department of Physics and Astronomy, College of Science, King Saud University, Riyadh, 11451, Kingdom of Saudi Arabia., Al-Qaisi S; Palestinian Ministry of Education and Higher Education, Nablus, Palestine., Faizan M; College of Materials Science and Engineering Jilin University, Changchun, China., Haq BU; Faculty of Science Education, Jeju National University, Jeju, 63243, Republic of Korea; Advanced Functional Materials & Optoelectronics Laboratory (AFMOL), Department of Physics, Faculty of Science, King Khalid University, P.O. Box 9004, Abha, Kingdom of Saudi Arabia., Laref A; Department of Physics and Astronomy, College of Science, King Saud University, Riyadh, 11451, Kingdom of Saudi Arabia. Electronic address: alaref@ksu.edu.sa., Alghamdi EA; Department of Physics and Astronomy, College of Science, King Saud University, Riyadh, 11451, Kingdom of Saudi Arabia., Nya FT; University of Maroua, High National College of Technology, Department of Energy and Environment, Cameroon; University of Maroua, Faculty of Science, Department of Physics, Materials Science Laboratory, P.O. Box 814, Maroua, Cameroon., Amine Monir ME; Faculty of the Exact Sciences, Mustapha Stambouli University of Mascara, B.P. 305, 29000, Mascara, Algeria., Chowdhury S; Faculty of Environmental Management, Prince of Songkla University, Songkhla, 90110, Thailand; Environmental Assessment and Technology for Hazardous Waste Management Research Centre, Faculty of Environmental Management, Prince of Songkla University, Songkhla, 90110, Thailand.
Publikováno v:
Journal of molecular graphics & modelling [J Mol Graph Model] 2024 Jun; Vol. 129, pp. 108729. Date of Electronic Publication: 2024 Feb 22.
Autor:
Sun J; Soft Bio-interface Electronics Lab, Center of Neural Engineering, CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Artificial Intelligence and Robotics for Society, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China.; MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, National and Local Joint Engineering Laboratory for Synthesis, Transformation and Separation of Extreme Environmental Nutrients, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, 150001, P. R. China., Yang R; Soft Bio-interface Electronics Lab, Center of Neural Engineering, CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Artificial Intelligence and Robotics for Society, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China., Li Q; Soft Bio-interface Electronics Lab, Center of Neural Engineering, CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Artificial Intelligence and Robotics for Society, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China., Zhu R; Key Laboratory of Quantitative Synthetic Biology, Shenzhen Institute of Synthetic Biology, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China., Jiang Y; School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore., Zang L; Key Laboratory of Quantitative Synthetic Biology, Shenzhen Institute of Synthetic Biology, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China., Zhang Z; Soft Bio-interface Electronics Lab, Center of Neural Engineering, CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Artificial Intelligence and Robotics for Society, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China., Tong W; Soft Bio-interface Electronics Lab, Center of Neural Engineering, CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Artificial Intelligence and Robotics for Society, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China., Zhao H; Soft Bio-interface Electronics Lab, Center of Neural Engineering, CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Artificial Intelligence and Robotics for Society, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China., Li T; Soft Bio-interface Electronics Lab, Center of Neural Engineering, CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Artificial Intelligence and Robotics for Society, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China., Li H; Soft Bio-interface Electronics Lab, Center of Neural Engineering, CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Artificial Intelligence and Robotics for Society, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China., Qi D; MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, National and Local Joint Engineering Laboratory for Synthesis, Transformation and Separation of Extreme Environmental Nutrients, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, 150001, P. R. China., Li G; Soft Bio-interface Electronics Lab, Center of Neural Engineering, CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Artificial Intelligence and Robotics for Society, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China., Chen X; School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore., Dai Z; Key Laboratory of Quantitative Synthetic Biology, Shenzhen Institute of Synthetic Biology, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China., Liu Z; Soft Bio-interface Electronics Lab, Center of Neural Engineering, CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Artificial Intelligence and Robotics for Society, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China.; Standard Robots Co.,Ltd,Room 405, Building D, Huafeng International Robot Fusen Industrial Park, Hangcheng Avenue, Guxing Community, Xixiang Street, Baoan District, Shenzhen, 518055, China.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Jun; Vol. 36 (25), pp. e2400110. Date of Electronic Publication: 2024 Mar 17.
Autor:
Hu Z; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Guo H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., An D; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Department of Engineering Mechanics, and International Research Center for Computational Mechanics, Dalian University of Technology, Dalian, 116024, P. R. China., Wu M; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA., Kaura A; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA., Oh H; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA., Wang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA., Zhao M; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Li S; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Yang Q; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., Ji X; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Simpson Querrey Institute, Northwestern University, Chicago, IL, 60611, USA., Li S; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., Wang B; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Department of Engineering Mechanics, and International Research Center for Computational Mechanics, Dalian University of Technology, Dalian, 116024, P. R. China., Yoo D; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Tran P; Developmental Therapeutics Core, Northwestern University, Evanston, IL, 60208, USA., Ghoreishi-Haack N; Developmental Therapeutics Core, Northwestern University, Evanston, IL, 60208, USA., Kozorovitskiy Y; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA., Huang Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., Li R; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Department of Engineering Mechanics, and International Research Center for Computational Mechanics, Dalian University of Technology, Dalian, 116024, P. R. China., Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Chemistry, Department of Neurological Surgery, Department of Electrical Engineering & Computer Science, Northwestern University, Evanston, IL, 60208, USA.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 May; Vol. 36 (19), pp. e2309421. Date of Electronic Publication: 2024 Feb 27.
Autor:
Hu Z; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Zhao J; State Key Laboratory of Molecular Engineering of Polymers, Department of Materials Science, Fudan University, Shanghai, 200433, China., Guo H; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Li R; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Department of Engineering Mechanics, and International Research Center for Computational Mechanics, Dalian University of Technology, Dalian, 116024, P. R. China., Wu M; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Shen J; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Wang Y; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA., Qiao Z; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Xu Y; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA., Haugstad G; Characterization Facility, University of Minnesota, 100 Union St. SE, Minneapolis, MN, 55455, USA., An D; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Department of Engineering Mechanics, and International Research Center for Computational Mechanics, Dalian University of Technology, Dalian, 116024, P. R. China., Xie Z; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Department of Engineering Mechanics, and International Research Center for Computational Mechanics, Dalian University of Technology, Dalian, 116024, P. R. China., Kandela I; Center for Developmental Therapeutics, Northwestern University, Evanston, IL, 60208, USA.; Chemistry Life Processes Institute, Northwestern University, Evanston, IL, 60208, USA., Nandoliya KR; Department of Neurological Surgery, Northwestern University Feinberg School of Medicine, Chicago, IL, 60611, USA., Chen Y; School of Physical Science and Technology, Shanghai Tech University, Shanghai, 201210, China., Yu Y; School of Physical Science and Technology, Shanghai Tech University, Shanghai, 201210, China., Yuan Q; State Key Laboratory of Molecular Engineering of Polymers, Department of Materials Science, Fudan University, Shanghai, 200433, China., Hou J; State Key Laboratory of Molecular Engineering of Polymers, Department of Materials Science, Fudan University, Shanghai, 200433, China., Deng Y; State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, 200240, China., AlDubayan AH; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Yang Q; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., Zeng L; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., Lu D; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Koo J; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Bai W; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Song E; Institute of Optoelectronics, Fudan University, Shanghai, 200433, P. R. China., Yao S; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Wolverton C; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Huang Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., Rogers JA; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Chemistry, Department of Neurological Surgery, and Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, 60208, USA.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Apr; Vol. 36 (15), pp. e2307782. Date of Electronic Publication: 2024 Feb 11.
Autor:
Lu C; State Key Laboratory of Marine Environmental Science (MEL), College of Ocean and Earth Sciences, Xiamen University, Xiamen, Fujian 361102, P.R. China., Wang X; State Key Laboratory of Marine Environmental Science (MEL), College of Ocean and Earth Sciences, Xiamen University, Xiamen, Fujian 361102, P.R. China., Liu XY; State Key Laboratory of Marine Environmental Science (MEL), College of Ocean and Earth Sciences, Xiamen University, Xiamen, Fujian 361102, P.R. China.
Publikováno v:
ACS biomaterials science & engineering [ACS Biomater Sci Eng] 2024 May 13; Vol. 10 (5), pp. 2784-2804. Date of Electronic Publication: 2024 Apr 10.
Autor:
Ruppel P; Department of Informatics, Universität Hamburg, 22527 Hamburg, Germany., Zhang J; Department of Informatics, Universität Hamburg, 22527 Hamburg, Germany.
Publikováno v:
Sensors (Basel, Switzerland) [Sensors (Basel)] 2024 Mar 16; Vol. 24 (6). Date of Electronic Publication: 2024 Mar 16.