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Electroplated solder joints for flip-chip applications

Autor: E.K. Yung, Iwona Turlik

Publikováno v: IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 14:549-559

A step-by-step description of a solder electroplating process for flip-chip applications is provided. The necessity of phasing Cr and Cu in the under-bump metallurgy (UBM), which also functions as the current path during plating, is verified by a sca

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ef1fb0509093de24e8a40c7fa03832e6
https://doi.org/10.1109/33.83943

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Akademický článek

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Research on single-channel variable polarization system with short switching time

Autor: Wenquan Che, E.K. Yung

Publikováno v: 2000 Asia-Pacific Microwave Conference. Proceedings (Cat. No.00TH8522).

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::2aac45d6450c428fb2c71b0895cc18ce
https://doi.org/10.1109/apmc.2000.926132

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Flip Chip Technology: A Method for Providing Known Good Die with High Density Interconnections

Autor: E.K. Yung, Iwona Turlik, N.G. Koopman, G.M. Adema, Glenn A. Rinne, C.J. Berry

Publikováno v: Proceedings of the International Conference on Multichip Modules.

Flip chip interconnections provide the highest interconnection density possible which makes this technology very attractive for use with multichip modules. However, several factors have hindered the use of this technology. These factors include the a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::6db2c22fc266b3d2cfb55d7159dcf95a
https://doi.org/10.1109/icmcm.1994.753527

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