Zobrazeno 1 - 10
of 239
pro vyhledávání: '"E. VANLATHEM"'
Autor:
M.V. BuIcke, Bart Vandevelde, M. Mohamed, C. Winters, Eric Beyne, Brian Robert Harkness, H. Meynen, E. Vanlathem, Lyndon Larson, Y.I. Lee, Mireia Bargallo Gonzalez
Publikováno v:
Scopus-Elsevier
Silicone Under the Bump (SUB) is a novel wafer level packaging (WLP) concept aimed at improving the reliability of solder joints. Poor reliability of the solder joints is amibuted to large stresses generated by a mismatch between the thermal expansio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e4dbdcf31c47710919309fda97c16673
https://doi.org/10.1109/ectc.2003.1216391
https://doi.org/10.1109/ectc.2003.1216391
Autor:
E. Vanlathem, E. Oellers
Publikováno v:
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
The advantages for using silicone materials in electronic and opto-electronic applications are varied. Their unique flexibility and stress relieving nature make them attractive for absorbing CTE mismatches on thermal cycling. Thermal and moisture pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea6d0593b5217339bdc22ac9d59699f0
https://doi.org/10.1109/polytr.2001.973303
https://doi.org/10.1109/polytr.2001.973303
Autor:
Katheria, Ankur1 (AUTHOR), Das, Palash1 (AUTHOR), Paul, Sangit1 (AUTHOR), Nath, Krishnendu1 (AUTHOR), Ghosh, Suman Kumar1 (AUTHOR), Das, Narayan Ch.1 (AUTHOR) ncdas@rtc.iitkgp.ac.in
Publikováno v:
Polymer Composites. Mar2023, Vol. 44 Issue 3, p1603-1616. 14p.
Autor:
Razavi‐Nouri, Mohammad1 (AUTHOR) m.razavi@ippi.ac.ir, Salavati, Masoud1 (AUTHOR)
Publikováno v:
Polymer Composites. Dec2022, Vol. 43 Issue 12, p8877-8889. 13p.
Autor:
Zhao, Zhongguo1 (AUTHOR), Shen, Siyang1 (AUTHOR), Li, Yapeng1 (AUTHOR), Zhang, Xin1 (AUTHOR), Su, Juqiao1,2 (AUTHOR), Li, Huan1 (AUTHOR), Ai, Taotao1 (AUTHOR) aitaotao0116@126.com, Tang, Dahang3 (AUTHOR) tangdahang0908@126.com
Publikováno v:
Polymer Composites. Jan2022, Vol. 43 Issue 1, p7-20. 14p.
Publikováno v:
Journal of Polymer Science; Nov2023, Vol. 61 Issue 21, p2567-2584, 18p
Autor:
Brigandi, Paul J.1 (AUTHOR) pjbrigandi@dow.com, Sengupta, Saurav1 (AUTHOR), Weinhold, Jeffrey2 (AUTHOR), Reffner, John R.1 (AUTHOR)
Publikováno v:
Polymer Composites. May2021, Vol. 42 Issue 5, p2360-2369. 10p.
Akademický článek
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Publikováno v:
Journal of Applied Physics; 4/7/2020, Vol. 127 Issue 13, p1-11, 11p, 3 Black and White Photographs, 1 Illustration, 1 Chart, 4 Graphs