Zobrazeno 1 - 10 of 135 pro vyhledávání: '"E. Simonyi"'
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3
Enhanced Grain Growth of Electroplated Copper on Cobalt-Containing Seed Layer
Autor: Qiang Huang, Marinus Hopstaken, Cyril Cabral, Eva E. Simonyi, Vaughn R. Deline, Brett Baker-O'Neal
Publikováno v: Journal of The Electrochemical Society. 160:D3045-D3050
Cu films with low impurities were electroplated on pure Cu, CuCo alloy and electrodeposited Co seed layers to study the room temperature grain growth behavior. As-evaporated Cu and CuCo alloy seed layers showed a significant enhancement effect on the
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::02a4efad125230ba8492fe2afaec5593
https://doi.org/10.1149/2.008312jes
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4
Low dielectric constant nanocomposite thin films based on silica nanoparticle and organic thermosets
Autor: Qinghuang Lin, Jeffrey C. Hedrick, Wen-Li Wu, Stephen A. Cohen, Hae-Jeong Lee, Brian Wayne Herbst, David P. Klaus, Eva E. Simonyi, Lynne Gignac, John Michael Warlaumont
Publikováno v: Journal of Polymer Science Part B: Polymer Physics. 45:1482-1493
Low dielectric constant (low-k) nanocomposite thin films have been prepared by spin coating and thermal cure of solution mixtures of one of two organic low-k thermoset prepolymers and a silica nanoparticle with an average diameter of about 8 nm. The
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b85a9e141c8b5a79020bf8f248d253fb
https://doi.org/10.1002/polb.21165
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5
Moisture-driven crack growth in blanket low dielectric constant and ultralow dielectric constant films
Autor: E. E. Simonyi, E. G. Liniger
Publikováno v: Journal of Applied Physics. 96:3482-3485
Moisture-driven crack growth was measured as a function of film thickness for a variety of low dielectric constant and ultralow dielectric constant films and a comparison of the crack driving force was made. By plotting the crack velocity versus the
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::206c0faa3ac26f719c7a400130433cf1
https://doi.org/10.1063/1.1774269
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6
A buckling-based metrology for measuring the elastic moduli of polymeric thin films
Autor: Christopher Harrison, Mark R. VanLandingham, Robert D. Miller, Willi Volksen, Christopher M. Stafford, Alamgir Karim, Ho-Cheol Kim, Eva E. Simonyi, Kathryn L. Beers, Eric J. Amis
Publikováno v: Nature Materials. 3:545-550
As technology continues towards smaller, thinner and lighter devices, more stringent demands are placed on thin polymer films as diffusion barriers, dielectric coatings, electronic packaging and so on. Therefore, there is a growing need for testing p
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0615edc7dbd942ff7d7ffca69bc0f244
https://doi.org/10.1038/nmat1175
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7
Processing dependent thermal conductivity of nanoporous silica xerogel films
Autor: Shyng Tsong Chen, Anurag Jain, Eva E. Simonyi, Joel L. Plawsky, Svetlana Rogojevic, William N. Gill, Shom Ponoth, Paul S. Ho
Publikováno v: Journal of Applied Physics. 91:3275-3281
Sintered xerogel films (porous SiO2) show a much higher thermal conductivity than other low dielectric constant (low-K) materials available for the same value of K. The thermal conductivity of xerogels which we have processed using different methods
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a2aee1392b7d03cae3735da459058e26
https://doi.org/10.1063/1.1448407
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9
Porous silica materials as low-k dielectrics for electronic and optical interconnects
Autor: Svetlana Rogojevic, Shom Ponoth, Anurag Jain, Peter D. Persans, William N. Gill, Joel L. Plawsky, Minoru Tomozawa, N. Agarwal, Eva E. Simonyi, I. Matthew
Publikováno v: Thin Solid Films. :513-522
The need to decrease signal delay and cross-talk in interconnects within integrated circuits is becoming increasingly important as device dimensions shrink. Electrical connections require lower resistivity metals and lower dielectric constant insulat
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::09e5289128dfc16c41b652ff0629eebf
https://doi.org/10.1016/s0040-6090(01)01311-6
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10
Ta and TaN adhesion to high-temperature fluorinated polyimides. Surface and interface chemistry
Autor: Kang-Wook Lee, E. Simonyi, C. Jahnes
Publikováno v: Journal of Adhesion Science and Technology. 12:773-790
The practical adhesion of Cu/Ta to high-temperature fluorinated polyimides (FPIs) was initially good but failed after the reliability test involving treatment under the FPI curing condition five times (T5). But a thin layer (40 nm) of TaN greatly imp
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::e6aab882fa8a717dfcc77870f233b342
https://doi.org/10.1163/156856198x00290
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