Zobrazeno 1 - 10
of 11
pro vyhledávání: '"E. S. Barbin"'
Publikováno v:
Gyroscopy and Navigation. 13:36-43
Publikováno v:
Materials Science Forum. 970:123-129
The article discusses the technological process for MEMS sensors manufacturing, which provides the minimum allowable technological defects to achieve MEMS technical characteristics. The paper deals with experiments on the definition of technological
Publikováno v:
Procedia Engineering. 168:904-907
The paper presents a new configuration of the gyroscope module comprising two sensors with antiphase primary vibrations and intermediate bodies on the axes of the informative secondary vibrations. This gyroscope module is a microelectromechanical acc
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 516:012009
Publikováno v:
2016 International Siberian Conference on Control and Communications (SIBCON).
The paper presents the effect of mechanical impact on the multiple-axis microelectromechanical system (MEMS) accelerometer. The parameters of accelerometer and its impact load allow considering the impact to be long and displacements induced by this
Microelectromechanical system accelerometers are widely used for metrological measurements of acceleration, tilt, vibration, and shock in moving objects. The paper presents the analysis of MEMS accelerometer that can be used for the structural inspec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1ddf2cd2239d4db4024590a8dce87da5
http://earchive.tpu.ru/handle/11683/33744
http://earchive.tpu.ru/handle/11683/33744
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 289:012003
The paper presents a new design of a shock-proof two-axis microelectromechanical gyroscope. Without stoppers, the shock load enables the interaction between the silicon sensor elements. Stoppers were installed in the gyroscope to prevent the contact
The aim of the research was to determine the effect of temperature on mechanical properties of a micromechanical gyroscope with the sensing element mounted on a silicon wafer, with the crystallographic orientation of (100) (110) (111). The research i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ac10973ae0cd5a243e92b2486f3f2820
http://earchive.tpu.ru/handle/11683/14740
http://earchive.tpu.ru/handle/11683/14740
Publikováno v:
IOP Conference Series: Materials Science & Engineering; Apr2019, Vol. 516 Issue 1, p1-1, 1p
Publikováno v:
IOP Conference Series: Materials Science & Engineering; Jan2018, Vol. 289 Issue 1, p1-1, 1p