Zobrazeno 1 - 10
of 12
pro vyhledávání: '"E. O. Shaffer"'
Publikováno v:
Macromolecular Symposia. 167:213-226
Scanning probe microscopy (SPM) techniques are used to characterize surfaces related to the processing of benzocyclobutene (BCB) dielectric thin films. Thermally cured resins and photodefineable resins are sold under the trade name CYLCOTENE 1) for e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7cf66be28a6924a98e272c94b61203b9
https://doi.org/10.1002/1521-3900(200103)167:1<213::aid-masy213>3.0.co
https://doi.org/10.1002/1521-3900(200103)167:1<213::aid-masy213>3.0.co
Autor:
Andrew J. G. Strandjord, Jack E. Hetzner, Greg Meyers, Jang-Hi Im, David D. Hawn, A. Chakrabarti, E. O. Shaffer, Cheryl L. Karas, Steve Froelicher, T. M. Stokich, J. Curphy
Publikováno v:
Journal of Electronic Packaging. 122:28-33
This work examines the mechanical performance of thin film coatings from Photosensitive-benzocyclobutene (Photo-BCB) formulations (Cyclotene2 4024, 4026 and 7200), on various substrate surfaces such as Al, Cu, Si, and SiN. The adhesion promoter used
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b96dd04f7367d216d04b06fd0eca0ccd
https://doi.org/10.1115/1.483128
https://doi.org/10.1115/1.483128
Publikováno v:
Polymer Engineering & Science. 36:2375-2381
A method to predict the ultimate adhesion performance of coatings subjected to biaxial, tensile stress is presented. A set of equations is developed to predict the onset of failure when the locus of failure is cohesive in the coating. The equations a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4591b4a7ed4f7530840b729861467f75
https://doi.org/10.1002/pen.10635
https://doi.org/10.1002/pen.10635
Publikováno v:
Journal of Polymer Science Part B: Polymer Physics. 30:259-264
The molecular weight for a dilute solution of cis-polybenzoxazole (PBO) in polyphosphoric acid (PPA) was determined by fitting the rheological data with a semiempirical polydisperse hybrid theory. The hybrid theory models a semiflexible rigid rod as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b23bdbb012adedc8e825a1d65024f168
https://doi.org/10.1002/polb.1992.090300305
https://doi.org/10.1002/polb.1992.090300305
Autor:
Gerald Beyer, Joost Waeterloos, Iwan Vervoort, Herbert Struyf, Zsolt Tokei, D. Price, Jack E. Hetzner, R. A Donaton, T. M. Stokich, M. Iwashita, Bart Coenegrachts, L. Booms, I. Vos, E. O. Shaffer, T. Komiya, Rudy Caluwaerts, Karen Maex, B. Sijmus
Publikováno v:
Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).
The feasibility of integrating a low permittivity spin-on hardmask (SoHM) into a Cu dual damascene structure using SiLK* Semiconductor Resin (*trademark of The Dow Chemical Company) has been investigated. The study focussed on the replacement of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdfdc80784221452e4595004103b5519
https://doi.org/10.1109/iitc.2001.930017
https://doi.org/10.1109/iitc.2001.930017
Publikováno v:
MRS Proceedings. 612
Adherence to the prescript of Moore's law continues to drive materials development for new and lower dielectric constant materials for use as back-end-of-line (BEOL) interlayer dielectric in advanced logic IC's. As is the case for the current generat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0075bd86364be9d15dd0520fd308343
https://doi.org/10.1557/proc-612-d1.1.1
https://doi.org/10.1557/proc-612-d1.1.1
Autor:
J. Curphy, Gregory F. Meyers, Jang-Hi Im, Jack E. Hetzner, G. Buske, E. O. Shaffer, Ted Stokich
Publikováno v:
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).
The adhesion performance of photo-BCB coatings were investigated using a new adhesion promoter, AP-3000, based on vinyltriacetoxysilane (VTAS) chemistry. A modified edge lift-off test (m-ELT) was employed to evaluate adhesion performance of photo-BCB
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::308bfb24ccf8d820fa5d995d33ec5413
https://doi.org/10.1109/isapm.1999.757286
https://doi.org/10.1109/isapm.1999.757286
Publikováno v:
Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102).
Successful integration of a polymer as an interlayer dielectric requires mechanical reliability to be maintained through all back-end of line (BEOL) processes. In this paper we use an integration demonstration of PE-CVD SiO/sub 2/ with Cyclotene/sup
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0335854ae71e6f52d81b4fadc880f1d
https://doi.org/10.1109/iitc.1998.704905
https://doi.org/10.1109/iitc.1998.704905
Autor:
James P. Godschalx, J. Marshall, Robert A. DeVries, D. Castillo, D. R. Romer, Gary R. Buske, Nelson G. Rondan, Jang-Hi Im, Steve Froelicher, Paul H. Townsend, Dennis W. Smith, E. O. Shaffer, S. J. Martin
Publikováno v:
MRS Proceedings. 476
A novel polymer has been developed for use as a thin film dielectric in the interconnect structure of high density integrated circuits. The coating is applied to the substrate as an oligomeric solution, SiLK*, using conventional spin coating equipmen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e1b7da0fa6f0bd03a5569afb458c2205
https://doi.org/10.1557/proc-476-9
https://doi.org/10.1557/proc-476-9
Publikováno v:
MRS Proceedings. 443
A novel polymer dielectric derived from tris-perfluorocyclobutene(PFCB) monomer has been investigated as a thin film dielectric. The dielectric constant of this material has been measured at 2.35. PFCB is applied from a hydrocarbon solvated solution
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f5387f744cb1b49923a9f9d8896356e
https://doi.org/10.1557/proc-443-35
https://doi.org/10.1557/proc-443-35