Zobrazeno 1 - 10
of 164
pro vyhledávání: '"E. Jalaguier"'
Autor:
F. Aguirre, E. Piros, L. Alff, C. Hochberger, J. Gehrunger, S. Petzold, N. Kaiser, E. Jalaguier, E. Nolot, C. Charpin-Nicolle, T. Vogel, L. Molina-Luna, J. Sune, E. Miranda
Publikováno v:
2022 IEEE 22nd International Conference on Nanotechnology (NANO).
Akademický článek
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Publikováno v:
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics, Springer Verlag, 2020, 31 (16), pp.13487-13495. ⟨10.1007/s10854-020-03903-9⟩
Journal of Materials Science: Materials in Electronics, 2020, 31 (16), pp.13487-13495. ⟨10.1007/s10854-020-03903-9⟩
Journal of Materials Science: Materials in Electronics, Springer Verlag, 2020, 31 (16), pp.13487-13495. ⟨10.1007/s10854-020-03903-9⟩
Journal of Materials Science: Materials in Electronics, 2020, 31 (16), pp.13487-13495. ⟨10.1007/s10854-020-03903-9⟩
Resistance switching is studied in conductive bridge memory structures made from atomic layer deposited HfO2 and Ag active electrode. Inert electrode is varied by using different substrates (TiN, W, Pt). HfO2 crystallinity is modified by varying the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::aa1f13a4389edf4a9d2e9b247f8b2062
https://hal.univ-grenoble-alpes.fr/hal-02916808
https://hal.univ-grenoble-alpes.fr/hal-02916808
Autor:
N. Guillaume, M. Azzaz, S. Blonkowski, E. Jalaguier, P. Gonon, C. Vallée, T. Blomberg, M. Tuominen, H. Sprey, S. Bernasconi, C. Charpin-Nicolle, E. Nowak
In this work, we propose a novel integration in order to significantly reduce the High Resistance State vari-ability and to improve thermal stability in Oxide-based Resistive Random Access Memory (OxRRAM) devices. A novel device featuring a metallic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::52fa07f8cfb143e1c0975225347b7fa4
Autor:
M. Bonvalot, S. Martinie, R. Sommer, Ph. Blaise, E. Nowak, Christelle Charpin-Nicolle, S. Belahcen, M.L. Cordeau, E. Jalaguier, S. Bernasconi, B. Eychenne, A. Persico
Publikováno v:
Microelectronic Engineering
Microelectronic Engineering, Elsevier, 2020, 221, pp.111194. ⟨10.1016/j.mee.2019.111194⟩
Microelectronic Engineering, 2020, 221, pp.111194. ⟨10.1016/j.mee.2019.111194⟩
Microelectronic Engineering, Elsevier, 2020, 221, pp.111194. ⟨10.1016/j.mee.2019.111194⟩
Microelectronic Engineering, 2020, 221, pp.111194. ⟨10.1016/j.mee.2019.111194⟩
International audience; In this work, we study the impact of roughness of TiN bottom electrode on the forming voltage of 1R TiN/HfO$_2$/Ti/TiN based ReRAM devices. A novel and atypical strategy is proposed to induce a controlled roughness of the bott
Autor:
A. Benoist, S. Bernasconi, G. Audoit, C. Guedj, Philippe Candelier, C. Fenouillet-Beranger, T. Dewolf, L. Perniola, E. Jalaguier, S. Jeannot, C. Charpin, Stephane Denorme, E. Vianello, M. Azzaz, Daniele Garbin, C. Cagli
Publikováno v:
Solid-State Electronics. 125:182-188
In this article, the reliability of HfO2-based RRAM devices integrated in an advanced 28 nm CMOS 16 kbit demonstrator is presented. In order to improve the memory performance, a thin Al2O3 layer is inserted in the HfO2-based memory stack (TiN/Ti/HfO2
Publikováno v:
2018 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS).
HfO 2 based resistive RAM devices as the important candidates of future embedded non-volatile memory technology were investigated using state of art physical and electrical characterization methods. Memory stacks used for measurements, named MARS, ha
Autor:
Jean-Luc Deschanvres, Hubert Renevier, Laetitia Rapenne, R. Viennet, E. Jalaguier, V. Jousseaume, Hervé Roussel, Maria Grazia Proietti
Publikováno v:
Zaguán. Repositorio Digital de la Universidad de Zaragoza
instname
Digital.CSIC. Repositorio Institucional del CSIC
instname
Digital.CSIC. Repositorio Institucional del CSIC
Hafnia-based resistive memories technology has come to maturation and acceded to the market of nonvolatile memories. Nevertheless, the physical mechanisms involved in resistive switching are not yet fully understood and the numerous ab initio simulat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::97d7ba23781112fcd26a4d6f6f531f3d
http://zaguan.unizar.es/record/74937
http://zaguan.unizar.es/record/74937
Akademický článek
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Autor:
Philippe Blaise, M. Barlas, Philippe Rodriguez, L. Grenouillet, L. Perniola, F. Mazen, M. Alayan, E. Jalaguier, Boubacar Traore, B. Sklenard, S. Jeannot, M. Guillermet, Elisa Vianello, E. Vilain, S. Bernasconi
Publikováno v:
ESSDERC
In this work, we study the impact of Si and Al implantation on the current conduction mechanisms and operation of 1T-1R TiN/HfO 2 /Ti/TiN based ReRAM devices. The pre-forming current and forming voltage evolution clearly reveal different trends as a