Zobrazeno 1 - 4
of 4
pro vyhledávání: '"E. J. Weitzman"'
Autor:
K. C. Yu, J. Defilippi, R. Tiwari, T. Sparks, D. Smith, M. Olivares, S. Selinidis, J. Zhang, K. Junker, G. Braekelmann, J. Farkas, K. S. Lee, S. Filipiak, M. Lindell, J. K. Watanabe, J. T. Wetzel, D. Jawarani, M. T. Herrick, N. G. Cave, C. C. Hobbs, J. J. Stankus, R. Mora, M. Freeman, T. Van Gompel, D. Denning, B. W. Fowler, S. Garcia, T. Newton, D. Pena, C. Keyes, T. Nguyen, S. Kirksey, T. Neil, J. Conner, J. J. Lee, R. Fox, R. Hershey, P. Crabtree, D. D. Sieloff, R. Blumenthal, E. J. Weitzman
Publikováno v:
MRS Proceedings. 565
The recent introduction of dual inlaid Cu and oxide based interconnects within sub-0.25μm CMOS technology has delivered higher performance and lower power devices. Further speed improvements and power reduction may be achieved by reducing the interc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f08f991c75acbf1a6610d5701d9c46a3
https://doi.org/10.1557/proc-565-151
https://doi.org/10.1557/proc-565-151
Autor:
E. J. Weitzman, Kyu C. Park
Publikováno v:
IBM Journal of Research and Development. 22:607-612
An electron-beam evaporation process has been developed that is capable of depositing stable, thick, borosilicate glass films (0.5-50 µm) on various substrates at a rate exceeding 0.5 µm/min. A very low stress of 4-10 × 107 N/m2 in compression was
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68f54393ad51c978847ff0f4722f2ee2
https://doi.org/10.1147/rd.226.0607
https://doi.org/10.1147/rd.226.0607
Autor:
K. C. Park, E. J. Weitzman
Publikováno v:
Journal of Vacuum Science and Technology. 14:1318-1319
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d6de7c26db7517ca87a5c6b51085eeb
https://doi.org/10.1116/1.569381
https://doi.org/10.1116/1.569381
Autor:
E. J. Weitzman, C. M. Osburn
Publikováno v:
Journal of The Electrochemical Society. 119:603
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3fe7c790b4bd9d8cb391c4b0b5d49035
https://doi.org/10.1149/1.2404270
https://doi.org/10.1149/1.2404270