Zobrazeno 1 - 10
of 22
pro vyhledávání: '"E. Hussa"'
Publikováno v:
Natural Hazards and Earth System Sciences, Vol 23, Pp 3185-3197 (2023)
A growing number of large cities are located near poorly understood faults that have not generated a significant earthquake in recent history. The Lembang Fault is one such fault located near the city of Bandung in West Java, Indonesia. The slip rate
Externí odkaz:
https://doaj.org/article/401dcb9f172641cf8e5c0e208121faa9
Publikováno v:
2005 7th Electronic Packaging Technology Conference.
Drop impact performance of solder joints of IC packages becomes a great concern for handheld products, such as mobile phones and PDA. Failure modes of solder joints under drop impact depend on solder alloys, interfacial strength, intermetallic formul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b805acd88fedfdf626d9d85b75b3d3dc
https://doi.org/10.1109/eptc.2005.1614369
https://doi.org/10.1109/eptc.2005.1614369
Autor:
E. Hussa, M. Sorrieul, T. Reinikainen, Hun Shen Ng, Jing-en Luan, A. Kujala, R. Bronner, Xavier Baraton, Kim Yong Goh, Tong Yan Tee
Publikováno v:
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
System-in-package (SiP) such as multi-chip or stacked die BGA modules with wirebond, flip-chip or hybrid interconnect are getting popular for advanced packaging applications. The design of SiP is more dependent on modeling as the package structure an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::808e79ddd036c678341388ca439f94c9
https://doi.org/10.1109/esime.2005.1502867
https://doi.org/10.1109/esime.2005.1502867
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
The semiconductor industry is driving toward lead-free solder due to environmental concern and legislation requirement. The industry has also concluded that SnAgCu solder alloy so far is the best lead-free alternative to SnPb solder. Therefore, most
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2be714dc8f2d2bfc1c98687a58b205d
https://doi.org/10.1109/ectc.2005.1441434
https://doi.org/10.1109/ectc.2005.1441434
Publikováno v:
Natural Hazards and Earth System Sciences, Vol 20, Pp 1533-1555 (2020)
More than half of all the people in the world now live in dense urban centres. The rapid expansion of cities, particularly in low-income nations, has enabled the economic and social development of millions of people. However, many of these cities are
Externí odkaz:
https://doaj.org/article/7e7dee2df0d7488ab1ca1cd61f5e1db7
Autor:
C. L. Hansen, B. J. J. McCormick, S. I. Azam, K. Ahmed, J. M. Baker, E. Hussain, A. Jahan, A. F. Jamison, S. L. Knobler, N. Samji, W. H. Shah, D. J. Spiro, E. D. Thomas, C. Viboud, Z. A. Rasmussen, for the Oshikhandass Diarrhea and Pneumonia Project
Publikováno v:
BMC Public Health, Vol 20, Iss 1, Pp 1-12 (2020)
Abstract Background Oshikhandass is a rural village in northern Pakistan where a 1989–1991 verbal autopsy study showed that diarrhea and pneumonia were the top causes of under-5 mortality. Intensive surveillance, active community health education a
Externí odkaz:
https://doaj.org/article/b7cf4cd943284d6ba633fe43d96c8b0b
Publikováno v:
The International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences, Vol XLII-5-W1, Pp 145-152 (2017)
This paper explored the capability of Landsat-8 Operational Land Imager (OLI) for post classification change detection analysis and mapping application because of its enhanced features from previous Landsat series. The OLI support vector machine (SV
Externí odkaz:
https://doaj.org/article/562982c046d2423e8ce7912608074043
Publikováno v:
The International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences, Vol XLII-1-W1, Pp 607-612 (2017)
This paper investigated the potential utility of Landsat-8 Operational Land Imager (OLI) for change detection analysis and mapping application because of its superior technical design to previous Landsat series. The OLI SVM classified data was succes
Externí odkaz:
https://doaj.org/article/494b07b3db5147568f4041b23605df16
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Akademický článek
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